Hostname: page-component-848d4c4894-tn8tq Total loading time: 0 Render date: 2024-06-14T15:55:30.806Z Has data issue: false hasContentIssue false

Process-Monitoring Via Impedance Spectroscopy

Published online by Cambridge University Press:  10 February 2011

Martin A. Seitz
Affiliation:
College of Engineering Marquette University Milwaukee, WI 53233
Richard W. Hirthe
Affiliation:
College of Engineering Marquette University Milwaukee, WI 53233
Charles J. Koehler
Affiliation:
College of Engineering Marquette University Milwaukee, WI 53233
Get access

Abstract

The improvement of process yields and efficiency are often dependent upon the availability of sensors that allow real-time in-process control. The sensitivity of impedance techniques to physical, chemical, and microstructural features of a material system offers significant potential in developing real-time sensors. Two examples of how impedance techniques can be used to follow changes in materials throughout out a process are discussed. The first of these involves monitoring the processibility and viability of solder pastes used in surface mount technology. The second example deals with monitoring the state of an ion exchange resin bed as used in water softeners.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Polcyznski, M., Seitz, M. A., and Hirthe, R., “A New Technique for Monitoring Solder Paste Characteristics For Process Control”, Surface Mount Technology, 4, No. 10, p. 5460, (October, 1990).Google Scholar
2. Polcyznski, M., Seitz, M. A., and Hirthe, R., “Measuring Solder Paste Metal Content Using Alternating Current Electrical Impedance Techniques”; Proc. of the 1990 International Symposium on Microelectronics, Chicago, Ill., Oct 15–17, p. 174182 (1990).Google Scholar
3. Polcyznski, M., Seitz, M. A., Hirthe, R., and Hoeller, T., “Use of AC Electrical Impedance Techniques for Monitoring Microstructural Changes in Electronic Materials”;, Proc. of the 1991 Internatl. Sym. on Microelectronics, Orlando, FL, Oct. 21–23, p. 431435, (1991).Google Scholar
4. Seitz, M. A., Hirthe, R. W., Amin, M., and Polcyznski, M., “Monitoring Solder Paste Properties Using Impedance Spectroscopy”;, Proc. of the 1992 International Symposium on Microelectronics, San Francisco, CA, Oct. 19–2 1, p. 503509, (1992)Google Scholar
5. Seitz, M. A., Hirthe, R., Amin, M., and Polcyznski, M., “Low Frequency Electrical Behavior of Solder Paste”;, Proc. of the 16th Annual Electronic Manufacturing Seminar, Naval Weapons Center, China Lake, CA. (1993).Google Scholar
6. Boukamp, B. A., “A Non Linear Least Squares Fit Procedure For Analysis Of Immittance Data Of Electrochemical Systems”;, Solid State lonics, 20, p. 3144, (1986); and B. A. Boukamp, Equivalent Circuit, (EQUIVCKT.PAS), Dept. of Chemical Technology, University of Twente, Netherlands, (1988/89).Google Scholar
7. Randles, J. E. B., “Kinetics of Electrode Reactions, Disc. Farad Soc., 1 p. 1119, (1947); and J. E. B. Randles, and K.W. Somerton, “Kinetics of Electrode Reactions, Parts 3 and 4, Trans. Farad Soc., 48, p. 937–950, 951–955, (1952).Google Scholar
8. Gileadi, E., Kirowa-Eisner, E., and Penciner, J., Interfacial Electrochemistry, Addison-Wesley Publishing, p. 8692, (1975).Google Scholar
9. Impedance Spectroscopy, edited by McDonald, J. R., John Wiley and Sons, p. 8495, (1987).Google Scholar
10. Seitz, M. A., Hirthe, R. W., and Frederickson, M. D., “Statistical Process Control of Solder Paste Using AC Impedance Spectroscopy”;, proc. 1995 International Symposium on Microelectronics, Los Angeles, CA., October 26, p 146153, (1995).Google Scholar
11. Tucci, M. A., Sutherland, G.K., “Regeneration Detector for Water Softeners,” U.S Patent No. 4320010, March 16, 1982.Google Scholar