Hostname: page-component-848d4c4894-8bljj Total loading time: 0 Render date: 2024-06-18T06:25:06.424Z Has data issue: false hasContentIssue false

Thermo-mechanical behavior of Fe thin films

Published online by Cambridge University Press:  01 February 2011

Nail R. Chamsoutdinov
Affiliation:
Materials Science Department, Delft University of Technology, Rotterdamseweg 137, Delft, 2628AL, The Netherlands.
Amarante J. Böttger
Affiliation:
Materials Science Department, Delft University of Technology, Rotterdamseweg 137, Delft, 2628AL, The Netherlands.
Rob Delhez
Affiliation:
Materials Science Department, Delft University of Technology, Rotterdamseweg 137, Delft, 2628AL, The Netherlands.
Frans D. Tichelaar
Affiliation:
Materials Science Department, Delft University of Technology, Rotterdamseweg 137, Delft, 2628AL, The Netherlands.
Get access

Abstract

The thermo-mechanical behavior of magnetron sputtered Fe polycrystalline films of thickness between 50 nm and 400 nm has been investigated. The state of stress has been determined by means of wafer curvature and X-ray diffraction (sin2ψ-method). Both methods are in good agreement for layers of thickness above 200 nm. For specimens of smaller layer thickness, however, the average stresses as measured by X-ray diffraction are systematically higher than those observed by wafer curvature experiments. The results can be interpreted in terms of differences in micro-strain (estimated using X-ray diffraction peak width analysis) and grain size as obtained by transmission and scanning electron microscopy. Thermal cycling experiments were performed between RT and 873 K. The effect of microstructure on thermo-mechanical properties was shown to be crucial.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Savader, J.B., Scanlon, M.R., Cammarata, R.C., Smith, D.T., Scripta Mat. 36, 29 (1997).Google Scholar
[2] Bernstein, S.D., Wong, T.Y., Tustison, R.W., J. Vac. Sci. Technol. A 17, 571 (1999).Google Scholar
[3] Kaye, G.W.C. and Laby, T.H., Tables of Physical and Chemical Constants, 16th edition (Longman, Essex, 1995), p. 213.Google Scholar
[4] Hauk, V.M. and Macherauch, E., Adv. in X-ray Anal., 27, 81 (1983).Google Scholar
[5] Delhez, R., de Keijser, T.H., Langford, J.I., Louër, D., Mittemeijer, E.J., Sonneveld, E.J. in The Rietveld Method, edited by Young, R.A. (Oxford University Press, New York, 1993), p. 141.Google Scholar
[6] Welzel, U. and Mittemeijer, E.J., J. Appl. Phys. 93, 9001 (2003).Google Scholar