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Atomic-scale simulations of multiple ion–solid interactions and structural evolution in silicon carbide
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- 31 January 2011, pp. 259-262
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Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders
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- 31 January 2011, pp. 263-266
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Chemical vapor deposition of cobalt using novel cobalt(I) precursors
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- 31 January 2011, pp. 267-270
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Disordering behavior and helium diffusion in He+ irradiated 6H–SiC
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- 31 January 2011, pp. 271-274
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Dielectric properties of epitaxial KNbO3 ferroelectric thin films
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- 31 January 2011, pp. 275-278
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Fabrication of TiNi shape memory alloy thin films by pulsed-laser deposition
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- 31 January 2011, pp. 279-283
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Growth of boron suboxide crystals in the B–B2O3 system at high pressure and high temperature
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- 31 January 2011, pp. 284-290
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Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
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- 31 January 2011, pp. 291-301
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Novel understanding of the YBa2Cu3O7–x thin film growth
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- 31 January 2011, pp. 302-305
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Porous reaction-sintered AlN tapes for high-performance microelectronics application
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- 31 January 2011, pp. 306-314
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Preparation and characterization of SiO2–B2O3–P2O5 particles and films generated by flame hydrolysis deposition for planar light-wave circuits
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- 31 January 2011, pp. 315-322
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Grain boundary faceting in YBa2Cu3O7–x bicrystal thin films on SrTiO3 substrates
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- 31 January 2011, pp. 323-335
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Formation of in-situ reinforced microstructure in α–sialon ceramics I: Stoichiometric oxygen-rich compositions
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- 31 January 2011, pp. 336-342
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Effects of an interposed Cu layer on the enhanced thermal stability of C49 TiSi2
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- 31 January 2011, pp. 343-347
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Coble-creep response and variability of grain-boundary properties
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- 31 January 2011, pp. 348-352
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Grain growth of precursor-derived nanocrystalline gallium nitride powder
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- 31 January 2011, pp. 353-357
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Interfaces between solution-derived LiMn2O4 thin films and MgO and Au/MgO substrates
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- 31 January 2011, pp. 358-366
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Effects of precursor additives on the stability of plasma enhanced chemical vapor deposited a-GeC(O):H films
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- 31 January 2011, pp. 367-375
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Squeeze casting of SiCp/Al-alloy composites with various contents of reinforcements
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- 31 January 2011, pp. 376-385
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Nitride-bonded silicon nitride from slip-cast Si + Si3N4 compacts
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- 31 January 2011, pp. 386-395
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