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Contributors
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- By Lenard A. Adler, Pinky Agarwal, Rehan Ahmed, Jagga Rao Alluri, Fawaz Al-Mufti, Samuel Alperin, Michael Amoashiy, Michael Andary, David J. Anschel, Padmaja Aradhya, Vandana Aspen, Esther Baldinger, Jee Bang, George D. Baquis, John J. Barry, Jason J. S. Barton, Julius Bazan, Amanda R. Bedford, Marlene Behrmann, Lourdes Bello-Espinosa, Ajay Berdia, Alan R. Berger, Mark Beyer, Don C. Bienfang, Kevin M. Biglan, Thomas M. Boes, Paul W. Brazis, Jonathan L. Brisman, Jeffrey A. Brown, Scott E. Brown, Ryan R. Byrne, Rina Caprarella, Casey A. Chamberlain, Wan-Tsu W. Chang, Grace M. Charles, Jasvinder Chawla, David Clark, Todd J. Cohen, Joe Colombo, Howard Crystal, Vladimir Dadashev, Sarita B. Dave, Jean Robert Desrouleaux, Richard L. Doty, Robert Duarte, Jeffrey S. Durmer, Christyn M. Edmundson, Eric R. Eggenberger, Steven Ender, Noam Epstein, Alberto J. Espay, Alan B. Ettinger, Niloofar (Nelly) Faghani, Amtul Farheen, Edward Firouztale, Rod Foroozan, Anne L. Foundas, David Elliot Friedman, Deborah I. Friedman, Steven J. Frucht, Oded Gerber, Tal Gilboa, Martin Gizzi, Teneille G. Gofton, Louis J. Goodrich, Malcolm H. Gottesman, Varda Gross-Tsur, Deepak Grover, David A. Gudis, John J. Halperin, Maxim D. Hammer, Andrew R. Harrison, L. Anne Hayman, Galen V. Henderson, Steven Herskovitz, Caitlin Hoffman, Laryssa A. Huryn, Andres M. Kanner, Gary P. Kaplan, Bashar Katirji, Kenneth R. Kaufman, Annie Killoran, Nina Kirz, Gad E. Klein, Danielle G. Koby, Christopher P. Kogut, W. Curt LaFrance, Patrick J.M. Lavin, Susan W. Law, James L. Levenson, Richard B. Lipton, Glenn Lopate, Daniel J. Luciano, Reema Maindiratta, Robert M. Mallery, Georgios Manousakis, Alan Mazurek, Luis J. Mejico, Dragana Micic, Ali Mokhtarzadeh, Walter J. Molofsky, Heather E. Moss, Mark L. Moster, Manpreet Multani, Siddhartha Nadkarni, George C. Newman, Rolla Nuoman, Paul A. Nyquist, Gaia Donata Oggioni, Odi Oguh, Denis Ostrovskiy, Kristina Y. Pao, Juwen Park, Anastas F. Pass, Victoria S. Pelak, Jeffrey Peterson, John Pile-Spellman, Misha L. Pless, Gregory M. Pontone, Aparna M. Prabhu, Michael T. Pulley, Philip Ragone, Prajwal Rajappa, Venkat Ramani, Sindhu Ramchandren, Ritesh A. Ramdhani, Ramses Ribot, Heidi D. Riney, Diana Rojas-Soto, Michael Ronthal, Daniel M. Rosenbaum, David B. Rosenfield, Durga Roy, Michael J. Ruckenstein, Max C. Rudansky, Eva Sahay, Friedhelm Sandbrink, Jade S. Schiffman, Angela Scicutella, Maroun T. Semaan, Robert C. Sergott, Aashit K. Shah, David M. Shaw, Amit M. Shelat, Claire A. Sheldon, Anant M. Shenoy, Yelizaveta Sher, Jessica A. Shields, Tanya Simuni, Rajpaul Singh, Eric E. Smouha, David Solomon, Mehri Songhorian, Steven A. Sparr, Egilius L. H. Spierings, Eve G. Spratt, Beth Stein, S.H. Subramony, Rosa Ana Tang, Cara Tannenbaum, Hakan Tekeli, Amanda J. Thompson, Michael J. Thorpy, Matthew J. Thurtell, Pedro J. Torrico, Ira M. Turner, Scott Uretsky, Ruth H. Walker, Deborah M. Weisbrot, Michael A. Williams, Jacques Winter, Randall J. Wright, Jay Elliot Yasen, Shicong Ye, G. Bryan Young, Huiying Yu, Ryan J. Zehnder
- Edited by Alan B. Ettinger, Albert Einstein College of Medicine, New York, Deborah M. Weisbrot, State University of New York, Stony Brook
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- Book:
- Neurologic Differential Diagnosis
- Published online:
- 05 June 2014
- Print publication:
- 17 April 2014, pp xi-xx
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Curved Silicon Electronics
- Linlin Wang, Dieter G. Ast, Peeyush Bhargava, Alan T. Zehnder
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- Journal:
- MRS Online Proceedings Library Archive / Volume 769 / 2003
- Published online by Cambridge University Press:
- 15 February 2011, H2.8
- Print publication:
- 2003
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An electronic imaging system using a curved image sensor can use a faster lens, and cover a greater field of view, than an imaging system using a planar sensor. The simpler lens systems also weight less, a decisive advantage in portable applications.
This paper describes a method to fabricate a curved silicon substrate from a flat wafer containing appropriate circuits. To curve the substrate, the processed wafer is diced, by dry-etching from the backside, into 1x1cm tiles. The tiles are separated by 0.5mm gaps, which are bridged, in turn, by a dense array of 45x100μm gold leads formed by electroplating using lithographically defined leads as seeds. Two methods were used to curve the wafer. In the first one, the wafer was bonded with epoxy to a PMMA disk, and then curved by heating the sandwich, under a load of ∼ 230gr, for 1.5 hrs at 130°C in a concave metal mold with a radius of curvature of 7.8cm. In the second method, the wafer was put into a curved metal mold, radius 14cm, loaded with 230gr, and heated to 290°C for 2 hrs. The normal and shear strains accommodated by the flexible interconnects were measured by analyzing their deformation. The experimentally measured strains are compared with a model that calculates the deformation required to deform a flat sheet into a spherical surface.
Nickel-Alumina Composites: In Situ Synthesis by a Displacement Reaction, and Mechanical Properties
- Steven A. Jones, James M. Burlitch, Ersan Üstündag, Jeannie Yoo, Alan T. Zehnder
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- Journal:
- MRS Online Proceedings Library Archive / Volume 365 / 1994
- Published online by Cambridge University Press:
- 15 February 2011, 53
- Print publication:
- 1994
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Nickel-alumina composites have the potential to be high performance materials. Alumina, with its excellent oxidation resistance, combined with a ductile phase such as nickel may provide a tough material with a lower density and higher Young's modulus, overall, a higher specific modulus than typical Superalloys. Dense, interpenetrating Ni-Al2O3 composites were synthesized using a displacement reaction between NiO and aluminum. The resulting composites were characterized in terms of their mechanical properties such as hardness, flexure strength, fracture toughness and elastic constants. The synthesis, characterization, and mechanical properties, as well as the effect of the interpenetrating microstructure on the toughening mechanisms and other properties will be discussed.