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Integration of a Polymer Etch Stop Layer in a Porous Low K MLM Structure
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- Journal:
- MRS Online Proceedings Library Archive / Volume 863 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, B2.11
- Print publication:
- 2005
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CVD Boron Carbo-Nitride as Pore Sealant for Ultra Low-K Interlayer Dielectrics
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- Journal:
- MRS Online Proceedings Library Archive / Volume 863 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, B6.8
- Print publication:
- 2005
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The Effect of Methylating Treatments on the Dielectric Reliability of Low-k/Cu Structures
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- Journal:
- MRS Online Proceedings Library Archive / Volume 863 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, B8.12
- Print publication:
- 2005
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