Hostname: page-component-848d4c4894-xm8r8 Total loading time: 0 Render date: 2024-06-20T22:22:33.008Z Has data issue: false hasContentIssue false
  • English
  • Français

3D Finite Element Simulation from Non-destructive X-ray Tomography and Verification with Novel Mechanical Testing and Digital Image Correlation In-situ of Focused Beam Microscope

Published online by Cambridge University Press:  30 July 2020

Joseph Favata ,
S. Ali Shojaee  and
Sina Shahbazmohamadi
Joseph Favata
Affiliation:
University of Connecticut, Willington, Connecticut, United States
S. Ali Shojaee
Affiliation:
Thermofisher Scientific, Austin, Texas, United States
Sina Shahbazmohamadi
Affiliation:
REFINE lab/ UCONN, Storrs, Connecticut, United States

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Advances in Modeling, Simulation, and Artificial Intelligence in Microscopy and Microanalysis for Physical and Biological Systems
Information
Microscopy and Microanalysis , Volume 26 , Supplement S2 , August 2020 , pp. 3104 - 3108
Check for updates
Copyright
Copyright © Microscopy Society of America 2020

References

Schindler, S. and Wohnig, K. W. M., “Development of a fine pitch copper wire bond process for integrated circuit devices,” in 31st International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary, 2008.Google Scholar
Harman, G., Wire Bonding in Microelectronics, 3rd ed., New York: McGraw-Hill, 2010.Google Scholar
Roma, M., “Interconnect Mechanisms in Microelectronic Packaging,” ProQuest Dissertations Publishing, Binghampton, 2016.Google Scholar
Zhang, G., “Reliability of wire bonds in micro-electronic packages,” Microelectronics International, vol. 25, no. 2, pp. 15-22, 2008.Google Scholar
Leong, G. C. and H. Uda, “Comparitive reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging,” PLoS ONE, vol. 8, no. 11, 2013.Google Scholar
Driel, W. v., Silfhout, R. V. and Zhang, G., “On wire failures in microelectronic packages,” IEEE Transactions on Device and Materials Reliability, vol. 9, no. 1, pp. 2-8, 2009.10.1109/TDMR.2008.2002343CrossRefGoogle Scholar
Favata, J. and Shahbazmohamadi, S., “Realistic on-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis,” Microelectronics Reliability, vol. 83, pp. 91-100, 2018.10.1016/j.microrel.2018.02.015CrossRefGoogle Scholar
Shahbazmohamadi, D. Forte, M. Tehranipoor, , “Advanced Physical Inspection Methods for Counterfeit IC Detection,” in Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis (ISTFA), Houston, 2014.Google Scholar
Mahmood, K., Carmona, P., Shahbazmohamadi, S., Pla, F. and Javidi, B., “Real-time automated counterfeit integrated circuit detection using x-ray microscopy,” Applied Optics, vol. 54, no. 13, pp. D25-D32, 2015.10.1364/AO.54.000D25CrossRefGoogle Scholar
Favata, J., Shahbazmohamadi, S., Ray, V. and Hadjikhani, A., “Real-time, direct measurement mechanical tester in-situ of scanning beam microscope”. Patent Application Number 16/569,384, (Patent Pending).Google Scholar
Favata, Joseph, “Correlative Framework of Techniques for the Inspection, Evaluation, and Design of Micro-electronic Devices” (2020). Doctoral Dissertations. 2402.Google Scholar