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In-Situ Ion Milling in the Transmission Electron Microscope (TEM) Outlook to a New Preparation Technique

Published online by Cambridge University Press:  02 July 2020

Peter Gnauck
Affiliation:
LEO Elektronenmikroskopie GmbH, D-73446Oberkochen, Germany
Claus Burkhardt
Affiliation:
Natural and Medical Institute (NMI), D-72770, Reutlingen, Germany
Erich Plies
Affiliation:
University of Tübingen, D-72076Tubingen, Germany
Wilfried Nisch
Affiliation:
Natural and Medical Institute (NMI), D-72770, Reutlingen, Germany
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Abstract

Recent developments in transmission electron microscopy put high demands on specimen preparation. in general the imaging quality is not limited by the performance of the microscope but by the quality of the specimen. in order to achieve a spatial resolution of 0.1 nm in HRTEM undamaged samples with a thickness below 10 nm are required. in energy filtering analytical electron microscopy (EFTEM), a constant specimen thickness over large areas and very low contamination is needed.

Conventional ion-milling techniques for TEM specimen preparation are essentially blind. Thus, it is left to chance whether the specimen detail of interest is suitable for TEM-imaging (many specimen areas are too thick). Another problem is the reaction of the specimen with the atmosphere during the transfer from the preparation stage to the microscope, which makes it very difficult to obtain the clean specimen surfaces that are needed in analytical EFTEM. Especially in high-resolution electron microscopy and electron holography the formation of amorphous oxidation and contamination layers on otherwise crystalline materials may seriously reduce the quality of high resolution images of the crystal structure.

Type
Applications and Developments of Focused Ion Beam (FIB) Instruments (Organized by L. Giannuzzi)
Copyright
Copyright © Microscopy Society of America 2001

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References

references

[1]Gnauck, P., Nisch, W., Plies, E.Proceedings of the 14 th International Congress on Electron Microscopy ICEM-14 August 31 - September 4, 1998, Cancun, Mexico Vol.3, 515.Google Scholar
[2]Burkhardt, C., Gnauck, P., Plies, E., Nisch, W. Proceedings of EUREM 2000Google Scholar