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A Best Known Method to Effectively Differentiate Elements with XEDS Peaks Overlapping for High-Volume Manufacturing of Semiconductor Device at Wafer Foundries

Published online by Cambridge University Press:  30 July 2021

Wayne Zhao
Wayne Zhao*
Affiliation:
GLOBALFOUNDRIES, Malta, New York, United States

Abstract

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Type
Microscopy and Microanalysis for Real World Problem Solving
Information
Microscopy and Microanalysis , Volume 27 , Supplement S1 , August 2021 , pp. 3154 - 3155
Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

Siddiqui, S., Galatage, R., Zhao, W., et al. , Microelectronic Engineering, Volume 223, (2020), p. 111219.CrossRefGoogle Scholar
Gribelyuk, M. A., Fu, B., Zhao, W., Journal of Applied Physics, 125, (2019); pp. 165306Google Scholar
Zhao, W. and Wang, Y. Y., Microscopy & Microanalysis, Vol. 21 (Supplement 1), (2017), pp.1490-1491.CrossRefGoogle Scholar
Thanks to Irene Brooks for proof-reading, Gerald Walker for his skillfulness in TEM-prep and Long Men for screening the TEM sample; and Fab8 Management and Legal teams for supporting the publication clearance.Google Scholar