Hostname: page-component-848d4c4894-xm8r8 Total loading time: 0 Render date: 2024-06-16T22:36:43.625Z Has data issue: false hasContentIssue false
  • English
  • Français

Characterization of Grain Structure and Porosity in Selective Laser Melted Cu-4.3Sn for Enhancing Electrical Connector Fabrication

Published online by Cambridge University Press:  23 September 2015

Anthony P. Ventura ,
C. Austin Wade ,
Wojciech Z. Misiolek ,
Masashi Watanabe ,
Greg Pawlikowski  and
Martin Bayes
Anthony P. Ventura
Affiliation:
Lehigh University, Materials Science and Engineering Department, Bethlehem, PA, USA
C. Austin Wade
Affiliation:
Lehigh University, Materials Science and Engineering Department, Bethlehem, PA, USA
Wojciech Z. Misiolek
Affiliation:
Lehigh University, Materials Science and Engineering Department, Bethlehem, PA, USA
Masashi Watanabe
Affiliation:
Lehigh University, Materials Science and Engineering Department, Bethlehem, PA, USA
Greg Pawlikowski
Affiliation:
TE Connectivity, Harrisburg, PA, USA
Martin Bayes
Affiliation:
TE Connectivity, Harrisburg, PA, USA

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 21 , Supplement S3: Proceedings of Microscopy & Microanalysis 2015 , August 2015 , pp. 133 - 134
Copyright
Copyright © Microscopy Society of America 2015 

References

[1] Davis, J.R. in “Copper and Copper Alloys: ASM Specialty Handbook”, ed. 1 (ASM International, Materials Park) p. 3.Google Scholar
[2] Thijs, L., etal., Acta Materialia 58 (2010). p. 3303.CrossRefGoogle Scholar
[3] Thijs, L., et al., Acta Materialia 61 (2013). p. 1809.CrossRefGoogle Scholar
[4] Niendorf, T., et al., Metallurgical and Materials Transactions 44B (2013). p. 794.CrossRefGoogle Scholar
[5] The authors would like to acknowledge the joint funding from the Research for Advanced Manufacturing in Pennsylvania program and TE Connectivity, Ltd.Google Scholar