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Chemistry and Bonding at {222}Mgo/Cu Heterophase Interfaces

Published online by Cambridge University Press:  02 July 2020

D. A. Müller
Affiliation:
School of Applied and Engineering Physics, Cornell University, Ithaca, NY14853
D. A. Shashkov
Affiliation:
Department of Materials Science & Engineering, Northwestern University, Evanston, IL60208
R. Benedek
Affiliation:
Department of Materials Science & Engineering, Northwestern University, Evanston, IL60208
L. H. Yang
Affiliation:
Condensed Matter Physics Division, Lawrence Livermore National Laboratory, Livermore, CA, 94551
D. N. Seidman
Affiliation:
Department of Materials Science & Engineering, Northwestern University, Evanston, IL60208
J. Silcox
Affiliation:
School of Applied and Engineering Physics, Cornell University, Ithaca, NY14853
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Extract

Adhesion at ceramic/metal (C/M) interfaces often controls the macroscopic behavior of materials containing metallic and ceramic phases, and experimental studies of bonding at C/M interfaces have recently been reported. Electron energy loss spectroscopy (EELS) offers unique opportunities to examine bonding at interfaces on an atomic scale. The EELS near edge fine structure is sensitive to local atomic arrangements and thus can be used as a coordination fingerprint. Much more can be done, however, by analyzing the connection between the EELS fine structure, the underlying local electronic structure and the cohesive energy of an interface to gain a deeper understanding of the nature of the adhesion at the interface.

In this work, we apply high spatial-resolution EELS instrument to study {222} MgO/Cu interfaces produced by internal oxidation. We determine interfacial chemistry of this interface with subnanometer resolution (Fig. 1) and use EELS to directly measure the electronic states pertaining to the interface

Type
Atomic Structure and Mechanisms at Interfaces in Materials
Copyright
Copyright © Microscopy Society of America 1997

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[8] This work was supported by DOE Giants DEFG02-87ER45322 and DEFG02-96ER45597. L. H. Yang, was supported by the DOE at LLNL under contract no. W-7405-ENG-48.Google Scholar