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Defect Analysis and Process Development of Microelectronics Devices Using Focused Ion Beam and Energy Filtering Transmission Electron Microscopy.

Published online by Cambridge University Press:  02 July 2020

R. Pantel ,
G. Mascarin  and
G. Auvert
R. Pantel
Affiliation:
France Telecom CNET, Chemin du Vieux chêneBP 98, F-38243, Meylan, France.
G. Mascarin
Affiliation:
France Telecom CNET, Chemin du Vieux chêneBP 98, F-38243, Meylan, France.
G. Auvert
Affiliation:
France Telecom CNET, Chemin du Vieux chêneBP 98, F-38243, Meylan, France.
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Extract

1. Introduction.

With continuing reductions in semiconductor device dimensions high spatial resolution physical and chemical analysis techniques will be more and more required for defect analysis and process development in the microelectronics field. Transmission Electron Microscopy (TEM) analysis is now extensively used thanks to the fast Focused Ion Beam (FIB) specimen preparation technique which has furthered its development. Recently, we have shown the advantages of adding Electron Energy Loss Spectroscopy (EELS) to FIB-TEM analysis for semiconductor process characterization. In this paper we extend the EELS technique using FIB sample preparation to Energy Filtering TEM (EFTEM) observations. The EFTEM analysis allows high-resolution compositional mapping using spectroscopic imaging of core level ionization edges3. We show some applications of FIB-EFTEM to defect analysis and process development.

2. Experimental details.

The FIB system is a MICRION model 9500 EX using a gallium ion beam of 50 keV maximum energy with a 5 nm minimum spot diameter.

Type
Precision Specimen Preparation
Information
Microscopy and Microanalysis , Volume 5 , Issue S2: Proceedings: Microscopy & Microanalysis '99, Microscopy Society of America 57th Annual Meeting, Microbeam Analysis Society 33rd Annual Meeting, Portland, Oregon August 1-5, 1999 , August 1999 , pp. 900 - 901
Copyright
Copyright © Microscopy Society of America

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References

1.)Hull, R.et al., Appl. Phys. Lett. 62 (1993) 3408CrossRefGoogle Scholar
2.)Pantel, R.et al., Microelectronic Engineering, 37 (1997) 49CrossRefGoogle Scholar
3.)Reimer, L., Energy-Filtering Transmission Electron Microscopy, Springer Verlag, Berlin (1995).CrossRefGoogle Scholar
4.) This work was performed within a cooperation between CNET France Telecom, CEA LETI and SGS Thomson Microelectronics.Google Scholar