Hostname: page-component-848d4c4894-r5zm4 Total loading time: 0 Render date: 2024-06-16T08:34:31.819Z Has data issue: false hasContentIssue false

Dependence of the Electron Beam Energy and Types of Surface to Determine EBSD Indexing Reliability in Yttria-Stabilized Zirconia

Published online by Cambridge University Press:  16 February 2012

Laxmikant V. Saraf*
Affiliation:
EMSL, Pacific Northwest National Laboratory Richland, WA 99352, USA
*
Corresponding author. E-mail: Lax.Saraf@pnl.gov
Get access

Abstract

Electron backscatter diffraction (EBSD) is a powerful technique for surface microstructure analysis. EBSD analysis of cubic yttria-stabilized zirconia (YSZ) is demonstrated. The statistics related to EBSD indexing reliability shows that the probability of accurate grain orientation detection increased significantly when the electron beam energy was increased from 10 to 30 kV. As a result of better sampling with increased interaction volume, a disparity between local and average grain misorientation angle also exhibited the dependence of the electron beam energy to determine the accuracy of grain orientation. To study EBSD indexing reliability as a function of surface roughness and overlayer formation, rapid EBSD measurement tests were performed on (a) YSZ surfaces ion-polished at ion beam energies of 65 nA at 30 kV and 1 nA at 30 kV and (b) carbon-coated versus uncoated YSZ surfaces. The EBSD results at both 10 and 30 kV electron beam energies indicate that EBSD indexing reliability is negatively affected by higher ion beam milling current and amorphous overlayer formation.

Type
Techniques and Software Development
Copyright
Copyright © Microscopy Society of America 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Baba-Kishi, K.Z. (2002). Review—Electron backscatter Kikuchi diffraction in the scanning electron microscope for crystallographic analysis. J Mater Sci 37, 17151746.CrossRefGoogle Scholar
Badwal, S.P.S. (1992). Zirconia-based solid electrolytes: Microstructure, stability and ionic conductivity. Solid State Ionics 52, 2332.CrossRefGoogle Scholar
Etsell, T.H. & Flengas, S.N. (1970). Electrical properties of solid oxide electrolytes. Chem Rev 70, 339376.Google Scholar
Field, D.P. (1997). Recent advances in the application of orientation imaging. Ultramicroscopy 67(1-4), 19.Google Scholar
Henager, C.H., Edwards, D.J., Schemer-Kohrn, A.L., Sundaram, S.K., Riley, B.J. & Bliss, M. (2008). Electron backscatter diffraction of a Ge growth tip from a vertical gradient freeze furnace. J Crystal Growth 311, 1014.CrossRefGoogle Scholar
Humbert, M., Gey, N., Patapy, C., Joussein, E., Huger, M., Guinebretiere, R., Chotard, T. & Hazotte, A. (2010). Identification and orientation determination of parent cubic domains from electron backscattered diffraction maps of monoclinic pure zirconia. Scripta Mater 63, 411414.CrossRefGoogle Scholar
Humphreys, F.J. (2001). Review—Grain and subgrain characterisation by electron backscatter diffraction. J Mater Sci 36, 38333854.CrossRefGoogle Scholar
Medevielle, A., Hugon, I. & Dugne, O. (1999). Electron backscattering diffraction (EBSD) application for nuclear materials. In Analysis of In Service Failures and Advances in Microstructural Characterization: Microstructural Science, vol. 26, pp. 265268. Materials Park, OH: ASM International.Google Scholar
Onda, T., Iwagaki, S., Morito, S. & Hayakawa, M. (2010). Shape-strain analysis of martensite in ceria-doped zirconia. Mater Trans 51, 899905.CrossRefGoogle Scholar
Principe, E.L. (2007). Focused Ion Beam System: Basics and Applications, Yao, N. (Ed.), pp. 146186. Cambridge, UK: Cambridge University Press.CrossRefGoogle Scholar
Radhakrishnan, R., Virkar, A.V. & Singhal, S.C. (2005). Estimation of charge-transfer resistivity of Pt cathode on YSZ electrolyte using patterned electrodes. J Electrochem Soc 152(5), A927A936.Google Scholar
Randle, V. (2004). Application of electron backscatter diffraction to grain boundary characterization. Int Mater Rev 49, 111.Google Scholar
Saraf, L.V. (2010). Site-specific Pt deposition and etching on electrically and thermally isolated SiO2 micro-disk surfaces. J Micromechan Microeng 20(4), 45031.CrossRefGoogle Scholar
Saraf, L.V. (2011a). Chromium grain-boundary segregation and effect of ion beam cleaning on Fe-Ni-Cr alloys. Praktische Metallographie 48(4), 184187.Google Scholar
Saraf, L.V. (2011b). Imaging chemical aggregation of Ni/NiO particles from reduced NiO-YSZ. Electrochem Solid-State Lett 14(10), B100B104.CrossRefGoogle Scholar
Saraf, L.V. (2011c). Realization of critical distance during the interplay between re-deposition and secondary sputtering from milling of angular side wall with a focused ion beam. Nucl Instrum Meth Phys Res B 269(13), 15401547.Google Scholar
Saraf, L.V. & Britt, D.W. (2011). Large area microcorrals and cavity formation on cantilevers using a focused ion beam. J Vac Sci Technol B 29(5), 051603.Google Scholar
Subbarao, E.C. & Maiti, H.S. (1984). Solid electrolytes with oxygen ion conduction. Solid State Ionics 11, 317338.Google Scholar
Uchic, M.D., Holzer, L., Inkson, B.J., Principe, E.L. & Munroe, P. (2007). 3D microstructural characterization using focused ion beam tomography. MRS Bull 32, 408416.CrossRefGoogle Scholar
Volkert, C.A. & Minor, A.M. (2007). Focused ion beam microscopy and micromachining. MRS Bull 32, 389399.CrossRefGoogle Scholar
Vonlanthen, P. & Grobety, B. (2008). CSL grain boundary distribution in alumina and zirconia ceramics. Ceram Int 34, 14591472.CrossRefGoogle Scholar
Wardle, S.T., Lin, L.S., Cetel, A. & Adams, B.L. (1994). Orientation imaging microscopy: Monitoring residual stress profiles in single crystals using an image quality parameter IQ. In Proceedings of the 52nd Annual Meeting of the Microscopy Society of America, Bailey, G.W. & Garratt-Reed, A.J. (Eds.), pp. 680681. San Francisco, CA: San Francisco Press.Google Scholar
Wright, S.I. & Adams, B.L. (1992). Automatic-analysis of electron backscatter diffraction patterns. Metal Trans A 23(3), 759767.Google Scholar
Wright, S.I. & Nowell, M.M. (2006). EBSD image quality mapping. Microsc Microanal 12, 7284.Google Scholar