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Detailed Calculations of Thermal Diffuse Scattering

Published online by Cambridge University Press:  02 July 2020

D.A. Müller ,
B. Edwards ,
E.J. Kirkland  and
J. Silcox
D.A. Müller
Affiliation:
Applied Physics and Cornell University, Ithaca, NY14853
B. Edwards
Affiliation:
Physics, Cornell University,Ithaca, NY14853
E.J. Kirkland
Affiliation:
Applied Physics and Cornell University, Ithaca, NY14853
J. Silcox
Affiliation:
Applied Physics and Cornell University, Ithaca, NY14853
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Extract

Convergent beam electron diffraction (CBED) produces a diffraction pattern from a single point on the specimen using a focused probe in the scanning transmission electron microscope (STEM). Because the incident wavefunction is a focused probe, each diffraction spot is enlarged to a disk the size of the objective aperture. Thermal vibration in the specimen reduces the intensity of the diffraction disks and introduces scattering in between the disk. This normally forbidden scattering between the diffraction disks is referred to as thermal diffuse scattering (TDS). The effects are most pronounced at large scattering angles, where TDS scattering can greatly reduce the intensity of the higher order Laue zone (HOLZ) lines. Previous work on modeling the TDS intensity involved the so-called frozen phonon method and the Einstein model of lattice vibration. The Einstein model assumes that each atom in the specimen vibrates independently of every other atom in the specimen and possible correlations among adjacent atoms are ignored.

Type
Computational Methods for Microscopy
Information
Microscopy and Microanalysis , Volume 3 , Issue S2: Proceedings: Microscopy & Microanalysis '97, Microscopy Society of America 55th Annual Meeting, Microbeam Analysis Society 31st Annual Meeting, Histochemical Society 48th Annual Meeting, Cleveland, Ohio, August 10-14, 1997 , August 1997 , pp. 1153 - 1154
Copyright
Copyright © Microscopy Society of America 1997

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References

[1] Xu, P.et al., Ultramicroscopy 38 (1991) 127.CrossRefGoogle Scholar

[2] Wang, Jianet al., Solid State Comm. 86 (1993) 731.Google Scholar

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[4] This work was supported by DOE Grant No. DE-FG02-87ER45322.Google Scholar