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Effectively Characterize Planar-view FinFET Semiconductor Device Etch Uniformity by Introducing Diffraction Contrast in STEM Imaging

Published online by Cambridge University Press:  01 August 2018

Wayne W. Zhao
Wayne W. Zhao*
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, NY

Abstract

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Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 390 - 391
Copyright
© Microscopy Society of America 2018 

References

[1] Zhao, W. , M. Gribelyuk, Microscopy & Microanalysis 22(S3 2016) p. 334.Google Scholar
[2] Zhao, W., et al, Microscopy & Microanalysis 21(S3 2015) p. 1036.Google Scholar
[3] Zhao, W., et al, Microscopy & Microanalysis 20(S3 2014) p. 362.Google Scholar
[4] Thanks go to Dong-Ick Lee for the TCAD cartoon, and to Albert Amann-III, Travis Mitchell, and Shaun Alvarez of GLOBALFOUNDRIES Fab8 for their excellence in TEM sample-preparations, and Fab8 Management, especially to Edward Crawford for proof-reading, and Legal teams for supporting the publication clearance..Google Scholar