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Electron-Beam Manipulated Nanoscale Reaction

Published online by Cambridge University Press:  05 August 2019

Huaping Sheng
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL, USA School of Physics and Technology, Center for Electron Microscopy, MOE Key Laboratory of Artificial Micro- and Nano-structures, and Institute for Advanced Studies, Wuhan University, Wuhan, China
Jianbo Wang*
Affiliation:
School of Physics and Technology, Center for Electron Microscopy, MOE Key Laboratory of Artificial Micro- and Nano-structures, and Institute for Advanced Studies, Wuhan University, Wuhan, China Science and Technology on High Strength Structural Materials Laboratory, Central South University, Changsha, China
Jianguo Wen*
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL, USA
*
*Corresponding author: wang@whu.edu.cn; jwen@anl.gov
*Corresponding author: wang@whu.edu.cn; jwen@anl.gov

Abstract

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Type
In situ TEM of Nanoscale Materials and Electronic Devices for Phase Transformation Studies
Copyright
Copyright © Microscopy Society of America 2019 

References

[1]Zheludkevich, ML et al. , Oxid. Met. 61 (2004), p. 39.Google Scholar
[2]Sun, L et al. , Langmuir 27 (2011), p. 14201.Google Scholar
[3]Electron microscopy was performed in the Center for Nanoscale Materials, a U.S. Department of Energy Office of Science User Facility under Contract No. DE-AC02-06CH11357. H. Sheng and J. Wang acknowledge the financial support from the National Natural Science Foundation of China (51671148, 51271134, J1210061, 11674251, 51501132, 51601132), the Hubei Provincial Natural Science Foundation of China (2016CFB446, 2016CFB155), the Fundamental Research Funds for the Central Universities, and the CERS-1-26 (CERS-China Equipment and Education Resources System), and the China Postdoctoral Science Foundation (2014T70734), and the Open Research Fund of Science and Technology on High Strength Structural Materials Laboratory (Central South University) and the Suzhou Science and Technology project (No. SYG201619).Google Scholar