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In situ TEM Investigation of the Electroplasticity Phenomenon on Dislocation Behavior in Ti-6wt%Al

Published online by Cambridge University Press:  30 July 2021

Xiaoqing Li
Affiliation:
University of California, Berkeley, United States
Shiteng Zhao
Affiliation:
UC Berkeley, United States
Ruopeng Zhang
Affiliation:
National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley94720, USA, United States
John Turner
Affiliation:
Lawrence Berkeley National Laboratory, United States
Karen C Bustillo
Affiliation:
Lawrence Berkeley National Laboratory, United States
Rohan Dhall
Affiliation:
Lawrence Berkeley National Laboratory, United States
Andrew Minor
Affiliation:
UC Berkeley, Berkeley, California, United States

Abstract

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Type
Defects in Materials: How We See and Understand Them
Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

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Li, X., Minor, A. M., Scripta Materialia, 197 (2021), 113764, 1359-6462.CrossRefGoogle Scholar
Zhao, S., Zhang, R., Chong, Y. et al. Defect reconfiguration in a Ti–Al alloy via electroplasticity. Nat. Mater. (2020).https://doi.org/10.1038/s41563-020-00817-z.Google Scholar