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In-Situ Low Energy Ion Milling with a FIB-SEM for TEM lift-out Sample Preparation of Copper Damascene Structures Fabricated with Low k porous SiLKTM Semiconductor Dielectric

Published online by Cambridge University Press:  24 July 2003

E. R. Beach ,
S. J. Rozeveld ,
C. J. Wood ,
M. V. Moore  and
J. Waeterloos
E. R. Beach
Affiliation:
The Dow Chemical Company, Analytical Sciences, 1897 Building, Midland, MI 48667
S. J. Rozeveld
Affiliation:
The Dow Chemical Company, Analytical Sciences, 1897 Building, Midland, MI 48667
C. J. Wood
Affiliation:
The Dow Chemical Company, Analytical Sciences, 1897 Building, Midland, MI 48667
M. V. Moore
Affiliation:
FEI Company, 7451 NW Evergreen Parkway, Hillsboro, OR 97124
J. Waeterloos
Affiliation:
The Dow Chemical Company, on assignment at the Interuniversity Microelectronics Center (IMEC), Leuven, Belgium

Abstract

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Information
Microscopy and Microanalysis , Volume 9 , Issue S02 , August 2003 , pp. 874 - 875
Copyright
Copyright © Microscopy Society of America 2003