Hostname: page-component-848d4c4894-ndmmz Total loading time: 0 Render date: 2024-05-16T03:05:29.505Z Has data issue: false hasContentIssue false

Redeposition Effects in TEM Sample Preparation of Feal-Based Metal Matrix Composites using the Focused Ion Beam Miller

Published online by Cambridge University Press:  02 July 2020

Julie M. Cairney
Affiliation:
Electron Microscope Unit, University of New South Wales, Sydney, NSW, 2052, Australia.
Paul R. Munroe
Affiliation:
Electron Microscope Unit, University of New South Wales, Sydney, NSW, 2052, Australia.
Get access

Extract

The focused ion beam miller (FIB) has been widely used in the semiconductor industry for many years, but only recently has its potential as a tool for materials science been recognised. The FIB uses a highly energetic beam of gallium ions to sputter material such that it can precisely section, as well as image, areas of interest. The FIB can be used to create crosssections, which can be examined in the FIB or in a scanning electron microscope (SEM). Cross sections can be made from delicate samples or samples in which a specific area needs to be viewed, for example to check the thickness of coatings or for failure analysis.

The FIB may also be used to prepare transmission electron microscope (TEM) specimens [1]. Extremely site-specific thin areas may be prepared with high positional accuracy from heterogeneous samples such as composites or layered structures.

Type
Applications and Developments of Focused Ion Beams
Copyright
Copyright © Microscopy Society of America

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

References:

1.Overwijk, M.H.F., et al., J. Vac. Sci. Technol., Bl 1 (1993)2021.CrossRefGoogle Scholar
2.Prenitzer, B.I. et al., Metall. Mater. Trans. A., 29A (1988)2399.Google Scholar
3.Cairney, J.M. et al., Microscopy and Microanalysis, in submission, (1999).Google Scholar