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Towards Enhancing the Throughput and Eliminating the 4 Dimensions of Stitching Errors in Large Area, High Resolution SEM for Integrated Circuit Reverse Engineering and Connectomics

Published online by Cambridge University Press:  25 July 2016

J. E. Sanabia ,
C. E. Korman ,
A. Popratiloff ,
V. Boegli ,
M. Rasche  and
R. Jede
J. E. Sanabia
Affiliation:
International Applications Center, Raith America, Inc., Troy, NY, USA
C. E. Korman
Affiliation:
Department of Electrical and Computer Engineering, The George Washington University, Washington, DC, USA
A. Popratiloff
Affiliation:
GW Center for Nanofabrication and Imaging, The George Washington University, Washington, DC, USA.
V. Boegli
Affiliation:
Raith GmbH, Dortmund, Germany.
M. Rasche
Affiliation:
Raith GmbH, Dortmund, Germany.
R. Jede
Affiliation:
Raith GmbH, Dortmund, Germany.

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 22 , Supplement S3: Proceedings of Microscopy & Microanalysis 2016 , July 2016 , pp. 588 - 589
Copyright
© Microscopy Society of America 2016 

References

References:

[1] Wanner, A A, et al, Journal of Microscopy 259 (2015). pp 137–142.Google Scholar
[2] Hayworth, K J, et al, Frontiers in Neural Circuits 8 (2014). pp 1–18.Google Scholar
[3] Brantner, C A, et al, Proceedings of Microscopy & Microanalysis (2015). pp 921–922.Google Scholar