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True Atomic-Scale Imaging in Three Dimensions: A Review of the Rebirth of Field-Ion Microscopy

Published online by Cambridge University Press:  24 March 2017

Francois Vurpillot ,
Frédéric Danoix ,
Matthieu Gilbert ,
Sebastian Koelling ,
Michal Dagan  and
David N. Seidman
Francois Vurpillot*
Affiliation:
Normandie Univ, UNIROUEN, INSA Rouen, CNRS, Groupe de Physique des Matériaux, F-76000 Rouen, France
Frédéric Danoix
Affiliation:
Normandie Univ, UNIROUEN, INSA Rouen, CNRS, Groupe de Physique des Matériaux, F-76000 Rouen, France
Matthieu Gilbert
Affiliation:
Normandie Univ, UNIROUEN, INSA Rouen, CNRS, Groupe de Physique des Matériaux, F-76000 Rouen, France
Sebastian Koelling
Affiliation:
Applied Physics, Photonics and Semiconductor Nanophysics, Eindhoven University of Technology, 5600MB Eindhoven, The Netherlands
Michal Dagan
Affiliation:
Department of Materials, University of Oxford, Parks Road, Oxford OX13PH, UK
David N. Seidman
Affiliation:
Department of Materials Science and Engineering, Northwestern University, 2220 Campus Drive, Evanston, IL 60208-3108, USA The Northwestern University Center for Atom-Probe Tomography (NUCAPT), Northwestern University, 2220 Campus Drive, Evanston, IL 60208-3108, USA
*
*Corresponding author. francois.vurpillot@univ-rouen.fr
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Abstract

This article reviews recent advances utilizing field-ion microscopy (FIM) to extract atomic-scale three-dimensional images of materials. This capability is not new, as the first atomic-scale reconstructions of features utilizing FIM were demonstrated decades ago. The rise of atom probe tomography, and the application of this latter technique in place of FIM has unfortunately severely limited further FIM development. Currently, the ubiquitous availability of extensive computing power makes it possible to treat and reconstruct FIM data digitally and this development allows the image sequences obtained utilizing FIM to be extremely valuable for many material science and engineering applications. This article demonstrates different applications of these capabilities, focusing on its use in physical metallurgy and semiconductor science and technology.

Keywords

Field-ion microscopytomographypoint defects
Type
Invited Reviews
Information
Microscopy and Microanalysis , Volume 23 , Special Issue 2: Atom Probe Tomography & Microscopy 2016 , April 2017 , pp. 210 - 220
Copyright
© Microscopy Society of America 2017 

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