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Materials for Future High Performance Magnetic Recording Heads

Published online by Cambridge University Press:  29 November 2013

Tomasz Jagielinski
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Recording in the 1990s will be high density, high frequency, in-contact recording on high coercivity media. Today's state-of-the-art head materials, NiFe, Sendust and amorphous alloys, will be used in some applications. However, layered structured and artificial superlattices will become the key head technologies of the future. Use of advanced preparation techniques will allow “true” materials engineering and the fabrication of devices to incredibly accurate specifications.

These very high density recording systems will require optimal inter-play between all the components—media, head, and head/media interface. Future media will be very smooth, high coercivity, large moment thin films. The head/media spacing will be less than 50 nm, and recording at more than 100 MHz will be required. Single-track heads will be replaced by very narrow track-width multitrack devices in high data rate recorders. Thin film heads will provide the answer to most of the problems of large recording fields and high frequency response. These changes will define new requirements for head materials, some of which cannot be met by currently used materials. Conventional ferrite heads will not be found in high performance recording systems; thin film inductive and magnetoresistive (MR) heads (Figure 1) will be widely used. Thin films, metals and alloys, both crystalline and amorphous, layered structures and artificial superlattices will be the key head technologies in the future. New material preparation technologies, MBE (molecular beam epitaxy), MOCVD (molecular chemical vapor deposition), sputtering, and ion beam deposition are becoming increasingly available and less expensive. These methods will be used to fabricate future devices to incredibly accurate specifications.

Type
Research Article
Information
MRS Bulletin , Volume 15 , Issue 3 , March 1990 , pp. 36 - 44
Copyright
Copyright © Materials Research Society 1990

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References

1.Umemoto, M., Eto, Y., Soiwamura, H., and Katayama, H., IEEE Trans. Magn. MAG-24 (1988) p. 2407.CrossRefGoogle Scholar
2.Romankiew, L.T., Grau, J.M., and Hatzakis, M., IEEE Trans. Magn. MAG-69 (1970) p. 587.Google Scholar
3.Jagielinski, T., Mater. Sci. & Engineering B3 (1989) p. 467.CrossRefGoogle Scholar
4.Jeffers, F., Proc. IEEE 74 (1986) p. 1540.CrossRefGoogle Scholar
5.Lemke, J., MRS Bulletin 15 (3) (1990) p. 31.CrossRefGoogle Scholar
6.Edelman, H., IEEE Trans. Magn, MAG-25 (1989) p. 3194.CrossRefGoogle Scholar
7.Markham, D. and Smith, N., IEEE Trans. Magn. MAG-24 (1988) p. 2606.CrossRefGoogle Scholar
8.Shelledy, F. and Brock, G., IEEE Trans. Magn. MAG-11 (1975) p. 1206.CrossRefGoogle Scholar
9.Markham, D. and Jeffers, F., Proc. American Electrochemical Society Meeting, 1989.Google Scholar
10.Freeman, J., Toussint, R., Smith, N., Wachenschwanz, D., Shtrikman, S., and Doyle, W., IEEE Trans. Magn. MAG-21 (1985) p. 1563.Google Scholar
11.Mamyama, T., Yamada, K., Totsumi, T., and Urai, M., IEEE Trans. Magn. MAG-24 (1988) p. 2404.Google Scholar
12.Jagielinski, T., J. Appl. Phys. 63 (1988) p. 4333.CrossRefGoogle Scholar
13.Bajorek, C. and Thompson, D., IEEE Trans. Magn. MAG-11 (1975) p. 1209.CrossRefGoogle Scholar
14.Kitada, M., Kamo, Y., Tanabau, H., Tsucheija, H., and Momata, K., J. Appl. Phys. 58 (1985) p. 1667.CrossRefGoogle Scholar
15.Cain, W.C., Markham, D., and Kryder, M.N., IEEE Trans. Magn. MAG-25 (1989) p. 3695.CrossRefGoogle Scholar
16.Hempstead, R., Kronbelb, S., and Thompson, D., IEEE Trans. Magn. MAG-14 (1978) p. 521.CrossRefGoogle Scholar
17.Klokholm, E. and Aboaf, J., J. Appl. Phys. 52 (1981) p. 2474.CrossRefGoogle Scholar
18.Shibaya, M. and Fukuda, I., IEEE Trans. Magn. MAG-13 (1977) p. 1029.CrossRefGoogle Scholar
19.Kajiwana, K., Hayakawa, M., Kunito, Y., Ikeda, Y., Mayashi, K., Aso, K., and Ishida, T., IEEE Trans. Magn. MAG-24 (1988) p. 2620.CrossRefGoogle Scholar
20.Kim, T.K. and Takahashi, M., Appl. Phys. Lett. 20 (1972) p. 492.CrossRefGoogle Scholar
21.MacLeren, J.M., McHenry, M.E., Crampin, S., and Eberhart, M.E., J. Appl. Phys. 66 (1989).Google Scholar
22.Li, C., Freeman, A.J., and Oguchi, T., Phys. Rev. Lett. 54 (1985) p. 2700.CrossRefGoogle Scholar
23.Terada, N., Hoshi, Y., Naoe, M., and Yamanaka, S., IEEE Trans. Magn. MAG-20 (1989) p. 1451.Google Scholar
24.Nagakubo, M. and Naoe, M., Mater. Sci. & Engineering (Netherlands) 99 (1988) p. 23.Google Scholar
25.Nagai, Y., Togo, A., Yanagisawa, K., and Toshima, T., J. Appl. Phys. 61 (1987) p. 3841.CrossRefGoogle Scholar
26.Kobayashi, T., Nakatani, R., Ootomo, S., Kumasaka, N., J. Appl. Phys. 63 (1988) p. 3203.CrossRefGoogle Scholar
27.Ishiwata, N., Wakabayashi, C., and Matsumoto, T., IEEE Trans. Magn. MAG-24 (1988) p. 3078.CrossRefGoogle Scholar
28.Nagai, Y. and Senda, M., J. Appl. Phys. 64 (1988) p. 4108.CrossRefGoogle Scholar
29.Nagai, Y., Yanagisawa, K., and Senda, M., J. Appl. Phys. 64 (1988) p. 1343.CrossRefGoogle Scholar
30.Senda, M. and Nagai, Y., Appl. Phys. Lett. 52 (1988) p. 672.CrossRefGoogle Scholar
31.Nagai, Y., Senda, M., and Toshima, T., J. Appl. Phys. 63 (1988) p. 1136.CrossRefGoogle Scholar
32.Nagai, Y. and Senda, M., Jpn. J. Appl. Phys. 26 (1987) p. L1514.CrossRefGoogle Scholar
33.Kobayashi, T., Nakatami, R., Ostomo, S., and Kumasaka, K., Jpn. J. Appl. Phys. 27 (1988) p. L1530.CrossRefGoogle Scholar
34.Hajashi, K., Hayakawa, M., Ishikawa, W., Ochici, Y., lwasaki, Y., and Aso, K., J. Appl. Phys. 64 (1988) p. 772.Google Scholar
35.Dirne, F.W.A. and Brouha, M., IEEE Trans. Magn. MAG-24 (1988) p. 1867.Google Scholar
36.Doyle, W. and Jagielinski, T. in Physics of Magnetic Materials, edited by Gorzkowski, W. (World Sci. 1987) p. 491.Google Scholar
37.Feng, J.S.Y. and Thompson, D.A., IEEE Trans. Magn. MAG-13 (1977) p. 1521.CrossRefGoogle Scholar
38.Slonczewski, J.C., Petek, B., and Argyle, B.E., IEEE Trans. Magn. MAG-27 (1988) p. 2045.CrossRefGoogle Scholar
39.Karamon, H., J. Appl. Phys. 63 (1988) p. 4306.CrossRefGoogle Scholar
40.Karamon, H., Masumoto, T., and Makino, Y., J. Appl. Phys. 57 (1985) p. 3527.CrossRefGoogle Scholar
41.Iwasaki, H. and Akiyama, J., J. Magn. Soc. Jpn. 12 (1988) p. 115.CrossRefGoogle Scholar
42.Nakamura, K., Echigo, N., Yohda, H., Mitani, S., and Kaminaka, N., IEEE Trans. Magn. MAG-23 (1988) p. 2482.Google Scholar
43.Fujimori, H., Monta, H., Yamamoto, M., and Zhary, J., IEEE Trans. Magn. MAG-22 (1986) p. 1101.CrossRefGoogle Scholar
44.Hosono, A. and Shimada, Y., J. Magn. Soc. Jpn. 10 (1986) p. 327.Google Scholar
45.Nagai, Y. and Senda, M., J. Appl. Phys. 64 (1988) p. 4108.CrossRefGoogle Scholar
46.Klokholm, E. and Aboaf, J., J. Appl. Phys. 52 (1981) p. 2479.CrossRefGoogle Scholar
47.Collins, A. and Sanders, I., Thin Solid Films 48 (1978) p. 247.CrossRefGoogle Scholar
48.McGuire, T.R. and Potter, R.I., IEEE Trans. Magn. MAG-11 (1975) p. 1010.Google Scholar
49.Nagai, Y. and Toshimi, T., J. Vac. Sci. Technol. A4 (1986) p. 2364.CrossRefGoogle Scholar
50.Kitada, M. and Shimizu, N., Thin Solid Films 158 (1988) p. 167.CrossRefGoogle Scholar
51.Barthelemy, A., Baibich, M.N., Broto, J.J., and Cabanel, R., in Growth, Characterization and Properties of Ultrathin Magnetic Films and Multilayers, edited by Jonker, B.T., Heremans, J.P., and Marinero, E.L. (Mater. Res. Soc. Symp. Proc. 151, Pittsburgh, PA, 1989) p. 43.Google Scholar
52.Jagielinski, T., J. Appl. Phys. 61 (1987) p. 3237.CrossRefGoogle Scholar
53.Brucker, C. and Smith, N., submitted for publication, Intermag, 1990.Google Scholar
54.Malozemoff, A.P., Phys. Rev. B 35 (1987) p. 3675.CrossRefGoogle Scholar
55.Russak, M.A., Rossnagel, S.M., Cohen, S.L., McGuire, T.R., Scilla, G.S., Jahnes, C.V., Baker, J.M., Cuomo, J.J., and Huang, C., J. Electrochem. Soc. 136 (1989) p. 1793.CrossRefGoogle Scholar
56.Smith, N., Kodak Research Laboratories, San Diego, private communication.Google Scholar
57.Markham, D., Kodak Research Laboratories, San Diego, private communication.Google Scholar
58.Uchida, H., Imakoshi, S., Y, Soda, Seiya, T., and Takino, H., IEEE Trans. Magn. MAG-18 (1982) p. 1152.CrossRefGoogle Scholar
59.van Groenon, A.B., Menlenbrocks, H.H.C., and de Jongh, M., Proc. of “Magnetic Recording Media” Conferencex, Rimini, Italy (1989).Google Scholar
60.Doyle, W., submitted for publication, Intermag 1990.Google Scholar