Hostname: page-component-76fb5796d-vfjqv Total loading time: 0 Render date: 2024-04-26T04:52:56.635Z Has data issue: false hasContentIssue false

30 Years of Electromigration Research: A Grand Masters' Perspective

Published online by Cambridge University Press:  15 February 2011

J. R. Lloyd*
Affiliation:
Lloyd and Thompson Associates, Inc., PO Box 194, Stow MA 01775-0194, www.ultranet.com\∼cthomp\
Get access

Extract

At the MRS Spring Meeting in San Francisco this year, a special historical session was held in the symposium on Materials Reliability in Microelectronics to reflect upon thirty years of research into electromigration as a failure mode in integrated circuits. Six of the original “discoverers” of electromigration as a reliability issue were invited to speak of their work and to relate stories of the early days of these historic efforts.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Bibliography

1. Black, J.R., Proc. 6th Ann. Intl. Reliab. Phys. Symp., 148 (1967).Google Scholar
2. Black, J.R., Proc. IEEE 57, 1587 (1969).Google Scholar
3. Lesk, I.A. and Black, J.R., Proc. 8th Ann. Intl. Reliab. Phys. Symp., 161 (1970).Google Scholar
4. Black, J.R., IEEE Trans. Electron Devices ED–17, 800 (1970).Google Scholar
5. Black, J.R., Proc. 16th Ann. Intl. Reliab. Phys. Symp., 233 (1978).Google Scholar
6. Black, J.R., Proc. 20th Ann. Intl. Reliab. Phys. Symp., 300 (1982).Google Scholar
7. Ilan Blech, A. and Sello, Harry, in Physics of Failure in Electronics, edited by Shilliday, Theodore S. (USAF Rome Air Development Center Reliability Series Proc. Vol. 5, Rome, NY, 1967) pp. 496501.Google Scholar
8. Blech, I.A. and Meiran, E.S., Appl. Phys. Lett. 11, 263 (1967).Google Scholar
9. Blech, I.A. and Meiran, E.S., Proc. 6th Ann. Intl. Reliab. Phys. Symp., 147 (1967).Google Scholar
10. Horowitz, S.J. and Blech, I.A., Mater. Sci. Eng. 10, 169 (1972).Google Scholar
11. Blech, I.A., Thin Solid Films 13, 117 (1972).Google Scholar
12. Blech, A. and Rosenberg, R., J. Appl. Phys. 46, 579 (1975).Google Scholar
13. Etzion, M., Blech, I.A., and Komem, Y., J. Appl. Phys. 46, 1455 (1975).Google Scholar
14. Blech, I.A. and Kinsbron, E., Thin Solid Films 25, 327 (1975).Google Scholar
15. Blech, I.A., J. Appi. Phys. 47, 1203 (1976).Google Scholar
16. Blech, I.A. and Tai, K.L., Appl. Phys. Lett. 30, 387 (1977).Google Scholar
17. Blech, I.A., J. Appl. Phys. 48, 473 (1977).Google Scholar
18. Kinsbron, E., Blech, I.A., and Komem, Y., Thin Solid Films 46, 139 (1977).Google Scholar
19. Ghate, P.B., Appi. Phys. Lett. 11, 14 (1967).Google Scholar
20. Blair, J.C., Ghate, P.B., and Haywood, C.T., Appl. Phys. Lett. 17, 281 (1970).Google Scholar
21. Blair, J.C., Ghate, P.B., and Haywood, C.T., Proc. IEEE (Lett.) 59, 1203 (1971).Google Scholar
22. Ghate, P.B. and Blair, J.C., Thin Solid Films 55, 113 (1978).Google Scholar
23. Ghate, P.B., DOD Report ADA093492.Google Scholar
24. Ghate, P.B., 19th Ann. Intl. Reliab. Phys. Symp., 243 (1981).Google Scholar
25. Hummel, R.E. and Slippy, W.A. Jr, Phys. Sta. Sol. (a) 2, K1 (1970).Google Scholar
26. Hummel, R.E. and Breitling, R.M., Appl. Phys. Lett., 18, 373 (1971).Google Scholar
27. Hummel, R.E. and Breitling, H.M., Z. Naturforsch. 26a, 36 (1971).Google Scholar
28. Hummel, R.E., Thin Solid Films 13, 175 (1972).Google Scholar
29. Hummel, R.E. and Geier, H.J., Thin Solid Films 25, 335 (1975).Google Scholar
30. Hummel, R.E., De Hoff, R.T., and Geier, H.J., J. Phys. Chem. Solids 37, 73 (1976).Google Scholar
31. Hummel, R.E., Krumeich, B.K., and De Hoff, R.T., Appl. Phys. Lett. 33, 960 (1978).Google Scholar
32. Hummel, R.E., DeHoff, R.T., Matts-Goho, S., and Goho, W.M., Thin Solid Films 78, 1 (1981).Google Scholar
33. Hummel, R.E. and Malone, D.W., in Materials Reliability Issues in Microelectronics, edited by Lloyd, James R., Yost, Frederick G., and Ho, Paul S. (Mat. Res. Soc. Proc. 225, Pittsburgh, PA, 1991) pp. 6777.Google Scholar
34. Hummel, R.E., International Materials Reviews 39, 97 (1994).Google Scholar
35. Ho, P.S. and Huntington, H.B., J. Phys. Chem. Solids 27, 1319 (1966).Google Scholar
36. Ho, P.S., J. Phys. Chem. Solids. 27, 1331 (1966).Google Scholar
37. Ho, P.S., J. Appl. Phys. 41, 64 (1970).Google Scholar
38. Ho, P.S. and Glowinski, L.D., Z. Naturforsch. 26a, 32 (1971).Google Scholar
39. Ho, P.S., Phys. Rev. 8, 4534 (1972).Google Scholar
40. Ho, P.S. and Howard, J.K., J. Appl. Phys. 45, 3229 (1974).Google Scholar
41. Ho, P.S. and Howard, J.K., Appl. Phys. Lett. 27, 261 (1975).Google Scholar
42. Ho, P.S., J. Appl. Phys. 49, 2735 (1978).Google Scholar
43. Howard, J.K., White, J.F., and Ho, P.S., J. Appl. Phys. 49, 4083 (1978).Google Scholar
44. Rosenberg, R. and Berenbaum, L., Appl. Phys. Lett. 12, 201 (1968).Google Scholar
45. Berenbaum, L. and Rosenberg, R., Thin Solid Films 4, 187 (1969).Google Scholar
46. Rosenberg, R., Appl. Phys. Lett. 16, 27 (1969).Google Scholar
47. Attardo, M.J. and Rosenberg, R., Proc. 8th Ann. Intl. Reliab. Phys. Symp., 115 (1970).Google Scholar
48. Attardo, M.J. and Rosenberg, R., J. Appl. Phys. 41, 2381 (1970).Google Scholar
49. Rosenberg, R. and Berenbaum, L., Proceedings of Europhys Conference on Atomic Transport (published by Z. Naturforschung, Germany), Marstrand, Sweden, June, 1970; also Rosenberg, R. and Berenbaum, L., in Atomic Transport in Solids and Liquids, edited by Lodding, A. and Lagerwall, T. (Verlag der Zeitschrift fur Naturforschung, Tubingen, Germany, 1971) p. 113.Google Scholar
50. Berenbaum, L. and Rosenberg, R., Proc. 9th Ann. Intl. Reliab. Phys. Symp., 136 (1971).Google Scholar
51. Rosenberg, R. and Ohring, M., J. Appl. Phys. 42, 5671 (1971).Google Scholar
52. Rosenberg, R., J. Vac. Sci. Technol. 9, 263 (1972).Google Scholar
53. d'Heurle, F.M. and Rosenberg, R., in Physics of Thin Films v.7, edited by Hass, G., Francombe, M.H., and Hoffman, R.W. (Academic Press, New York, 1973), p. 257.Google Scholar
54. Blech, I.A. and Rosenberg, R., J. Appl. Phys. 46, 579 (1975).Google Scholar
1. Black, J.R., Proc. 6th Ann. Intl. Reliab. Phys. Symp., 148 (1967).Google Scholar
2. Black, J.R., Proc. IEEE 57, 1587 (1969).Google Scholar
3. Lesk, I.A. and Black, J.R., Proc. 8th Ann. Intl. Reliab. Phys. Symp., 161 (1970).Google Scholar
4. Black, J.R., IEEE Trans. Electron Devices ED–17, 800 (1970).Google Scholar
5. Black, J.R., Proc. 16th Ann. Intl. Reliab. Phys. Symp., 233 (1978).Google Scholar
6. Black, J.R., Proc. 20th Ann. Intl. Reliab. Phys. Symp., 300 (1982).Google Scholar
7. Ilan Blech, A. and Sello, Harry, in Physics of Failure in Electronics, edited by Shilliday, Theodore S. (USAF Rome Air Development Center Reliability Series Proc. Vol. 5, Rome, NY, 1967) pp. 496501.Google Scholar
8. Blech, I.A. and Meiran, E.S., Appl. Phys. Lett. 11, 263 (1967).Google Scholar
9. Blech, I.A. and Meiran, E.S., Proc. 6th Ann. Intl. Reliab. Phys. Symp., 147 (1967).Google Scholar
10. Horowitz, S.J. and Blech, I.A., Mater. Sci. Eng. 10, 169 (1972).Google Scholar
11. Blech, I.A., Thin Solid Films 13, 117 (1972).Google Scholar
12. Blech, A. and Rosenberg, R., J. Appl. Phys. 46, 579 (1975).Google Scholar
13. Etzion, M., Blech, I.A., and Komem, Y., J. Appl. Phys. 46, 1455 (1975).Google Scholar
14. Blech, I.A. and Kinsbron, E., Thin Solid Films 25, 327 (1975).Google Scholar
15. Blech, I.A., J. Appi. Phys. 47, 1203 (1976).Google Scholar
16. Blech, I.A. and Tai, K.L., Appl. Phys. Lett. 30, 387 (1977).Google Scholar
17. Blech, I.A., J. Appl. Phys. 48, 473 (1977).Google Scholar
18. Kinsbron, E., Blech, I.A., and Komem, Y., Thin Solid Films 46, 139 (1977).Google Scholar
19. Ghate, P.B., Appi. Phys. Lett. 11, 14 (1967).Google Scholar
20. Blair, J.C., Ghate, P.B., and Haywood, C.T., Appl. Phys. Lett. 17, 281 (1970).Google Scholar
21. Blair, J.C., Ghate, P.B., and Haywood, C.T., Proc. IEEE (Lett.) 59, 1203 (1971).Google Scholar
22. Ghate, P.B. and Blair, J.C., Thin Solid Films 55, 113 (1978).Google Scholar
23. Ghate, P.B., DOD Report ADA093492.Google Scholar
24. Ghate, P.B., 19th Ann. Intl. Reliab. Phys. Symp., 243 (1981).Google Scholar
25. Hummel, R.E. and Slippy, W.A. Jr, Phys. Sta. Sol. (a) 2, K1 (1970).Google Scholar
26. Hummel, R.E. and Breitling, R.M., Appl. Phys. Lett., 18, 373 (1971).Google Scholar
27. Hummel, R.E. and Breitling, H.M., Z. Naturforsch. 26a, 36 (1971).Google Scholar
28. Hummel, R.E., Thin Solid Films 13, 175 (1972).Google Scholar
29. Hummel, R.E. and Geier, H.J., Thin Solid Films 25, 335 (1975).Google Scholar
30. Hummel, R.E., De Hoff, R.T., and Geier, H.J., J. Phys. Chem. Solids 37, 73 (1976).Google Scholar
31. Hummel, R.E., Krumeich, B.K., and De Hoff, R.T., Appl. Phys. Lett. 33, 960 (1978).Google Scholar
32. Hummel, R.E., DeHoff, R.T., Matts-Goho, S., and Goho, W.M., Thin Solid Films 78, 1 (1981).Google Scholar
33. Hummel, R.E. and Malone, D.W., in Materials Reliability Issues in Microelectronics, edited by Lloyd, James R., Yost, Frederick G., and Ho, Paul S. (Mat. Res. Soc. Proc. 225, Pittsburgh, PA, 1991) pp. 6777.Google Scholar
34. Hummel, R.E., International Materials Reviews 39, 97 (1994).Google Scholar
35. Ho, P.S. and Huntington, H.B., J. Phys. Chem. Solids 27, 1319 (1966).Google Scholar
36. Ho, P.S., J. Phys. Chem. Solids. 27, 1331 (1966).Google Scholar
37. Ho, P.S., J. Appl. Phys. 41, 64 (1970).Google Scholar
38. Ho, P.S. and Glowinski, L.D., Z. Naturforsch. 26a, 32 (1971).Google Scholar
39. Ho, P.S., Phys. Rev. 8, 4534 (1972).Google Scholar
40. Ho, P.S. and Howard, J.K., J. Appl. Phys. 45, 3229 (1974).Google Scholar
41. Ho, P.S. and Howard, J.K., Appl. Phys. Lett. 27, 261 (1975).Google Scholar
42. Ho, P.S., J. Appl. Phys. 49, 2735 (1978).Google Scholar
43. Howard, J.K., White, J.F., and Ho, P.S., J. Appl. Phys. 49, 4083 (1978).Google Scholar
44. Rosenberg, R. and Berenbaum, L., Appl. Phys. Lett. 12, 201 (1968).Google Scholar
45. Berenbaum, L. and Rosenberg, R., Thin Solid Films 4, 187 (1969).Google Scholar
46. Rosenberg, R., Appl. Phys. Lett. 16, 27 (1969).Google Scholar
47. Attardo, M.J. and Rosenberg, R., Proc. 8th Ann. Intl. Reliab. Phys. Symp., 115 (1970).Google Scholar
48. Attardo, M.J. and Rosenberg, R., J. Appl. Phys. 41, 2381 (1970).Google Scholar
49. Rosenberg, R. and Berenbaum, L., Proceedings of Europhys Conference on Atomic Transport (published by Z. Naturforschung, Germany), Marstrand, Sweden, June, 1970; also Rosenberg, R. and Berenbaum, L., in Atomic Transport in Solids and Liquids, edited by Lodding, A. and Lagerwall, T. (Verlag der Zeitschrift fur Naturforschung, Tubingen, Germany, 1971) p. 113.Google Scholar
50. Berenbaum, L. and Rosenberg, R., Proc. 9th Ann. Intl. Reliab. Phys. Symp., 136 (1971).Google Scholar
51. Rosenberg, R. and Ohring, M., J. Appl. Phys. 42, 5671 (1971).Google Scholar
52. Rosenberg, R., J. Vac. Sci. Technol. 9, 263 (1972).Google Scholar
53. d'Heurle, F.M. and Rosenberg, R., in Physics of Thin Films v.7, edited by Hass, G., Francombe, M.H., and Hoffman, R.W. (Academic Press, New York, 1973), p. 257.Google Scholar
54. Blech, I.A. and Rosenberg, R., J. Appl. Phys. 46, 579 (1975).Google Scholar