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A Comprehensive Study of Plasma Enhanced Crystallization of a-Si:H Films on Glass

Published online by Cambridge University Press:  15 February 2011

Aiguo Yin
Affiliation:
Electronic Materials and Processing Research Laboratory, The Pennsylvania State University, University Park, PA 16802.
Stephen J. Fonash
Affiliation:
Electronic Materials and Processing Research Laboratory, The Pennsylvania State University, University Park, PA 16802.
D. M. Reber
Affiliation:
Electronic Materials and Processing Research Laboratory, The Pennsylvania State University, University Park, PA 16802.
Y. M. Li
Affiliation:
Solarax Corporation, Thin-Film Division, Newtown, PA 18940
M. Bennett
Affiliation:
Solarax Corporation, Thin-Film Division, Newtown, PA 18940
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Abstract

An extensive study is reported here on plasma enhanced crystallization of a-Si:H films on glass. Both electron cyclotron resonance (ECR) helium plasma exposures and ECR oxygen plasma exposures were investigated to obtain enhanced crystallization of a-Si:H films. We have found that the ECR helium plasma exposure can render more crystallization enhancement than the ECR oxygen plasma exposure. This is because ECR helium plasma exposures can produce more dangling Si bonds, voids, and “interstitial” Si atoms in a-Si:H films than ECR oxygen plasma exposures. These dangling Si bonds, voids, and “interstitial” Si atoms are believed to be the cause of the observed reduced incubation time as well as enhanced grain growth of the plasma exposed a-Si:H films in subsequent crystallization processes. This model is supported by the effects of plasma exposure time on the enhanced crystallization process of a-Si:H films.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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