Hostname: page-component-848d4c4894-hfldf Total loading time: 0 Render date: 2024-05-01T06:40:57.333Z Has data issue: false hasContentIssue false

High Hydrogen Content Silicon Nitride For Photovoltaic Applications Deposited By Hot-Wire Chemical Vapor Deposition

Published online by Cambridge University Press:  01 February 2011

Jason K. Holt
Affiliation:
Laboratories of Applied PhysicsCalifornia Institute of TechnologyPasadena, CA 91125
Maribeth Swiatek
Affiliation:
Laboratories of Applied PhysicsCalifornia Institute of TechnologyPasadena, CA 91125
David G. Goodwin
Affiliation:
Laboratories of Applied PhysicsCalifornia Institute of TechnologyPasadena, CA 91125
Harry A. Atwater
Affiliation:
Laboratories of Applied PhysicsCalifornia Institute of TechnologyPasadena, CA 91125
Thomas J. Watson
Affiliation:
Laboratories of Applied PhysicsCalifornia Institute of TechnologyPasadena, CA 91125
Get access

Abstract

Silicon nitride films have been grown by hot-wire chemical vapor deposition and film properties have been characterized as a function of SiH4/NH3 flow ratio. Quadrupole mass spectrometry measurements revealed that NH3 should be present in large excess relative to SiH4 (<10), due to its lower decomposition probability on the wire. Silicon nitride films were produced with refractive indices ranging from 1.8-2.5 and H-content from 9-18 atomic % as the flow ratio increased from 1% to 8%. Fourier Transform Infrared Spectroscopy revealed a change from predominantly N-H to Si-H bonding as the flow ratio increases beyond 6%. Subsequent annealing studies showed different kinetics for H release from Si versus N. Films grown with a low SiH4/NH3 ratio were found to oxidize readily (23 atomic %), while larger ratios yielded no oxygen incorporation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Sato, H., Izumi, A., and Matsumura, H., Appl. Phys. Lett. 77, 2752 (2000).10.1063/1.1319513Google Scholar
[2] Lanford, W. and Rand, M., J. Appl. Phys. 49, 2473 (1978).10.1063/1.325095Google Scholar
[3] Matsumura, H., Jpn. J. Appl. Phys. 37, 31753187 (1998).10.1143/JJAP.37.3175Google Scholar
[4] Stannowski, B., Veen, M. van, and Schropp, R.E.I., Mat. Res. Soc. Symp. Proc. 664, A17.3 (2001).Google Scholar
[5] Holt, J., Swiatek, M., Goodwin, D., and Atwater, H., to be submitted (2002).Google Scholar
[6] Sanderson, R., Chemical Bonds and Bond Energy, Academic Press, New York, (1976).Google Scholar
[7] Kaluri, S. and Hess, D., Appl. Phys. Lett. 69, 1053 (1996).Google Scholar
[8] Yelundur, V., Rohatgi, A., Ebong, A., Gabor, A., Hanoka, J., and Wallace, R., J. Electron. Mater. 30, 526 (2001).10.1007/s11664-001-0093-0Google Scholar
[9] Boehme, C. and Lucovsky, G., J. Appl. Phys. 88, 6055 (2000).Google Scholar