Hostname: page-component-76fb5796d-r6qrq Total loading time: 0 Render date: 2024-04-30T01:48:39.269Z Has data issue: false hasContentIssue false
  • English
  • Français

Matrix Assisted Pulsed Laser Evaporation Direct Write (MAPLE DW): A New Method to Rapidly Prototype Active and Passive Electronic Circuit Elements

Published online by Cambridge University Press:  10 February 2011

J.M. Fitz-Gerald ,
D.B. Chrisey ,
A. Piqu ,
R.C.Y. Auyeung ,
R. Mohdi ,
H.D. Young ,
H.D. Wu ,
S. Lakeou  and
R. Chung
J.M. Fitz-Gerald
Affiliation:
Naval Research Laboratory, Washington, D.C
D.B. Chrisey
Affiliation:
Naval Research Laboratory, Washington, D.C
A. Piqu
Affiliation:
Naval Research Laboratory, Washington, D.C
R.C.Y. Auyeung
Affiliation:
Naval Research Laboratory, Washington, D.C
R. Mohdi
Affiliation:
Naval Research Laboratory, Washington, D.C
H.D. Young
Affiliation:
Naval Research Laboratory, Washington, D.C
H.D. Wu
Affiliation:
Naval Research Laboratory, Washington, D.C
S. Lakeou
Affiliation:
Naval Research Laboratory, Washington, D.C
R. Chung
Affiliation:
Naval Research Laboratory, Washington, D.C
Get access

Abstract

We demonstrate a novel laser-based approach to perform rapid prototyping of active and passive circuit elements called MAPLE DW. This technique is similar in its implementation to laser induced forward transfer (LIFT), but different in terms of the fundamental transfer mechanism and materials used. In MAPLE DW, a focused pulsed laser beam interacts with a composite material on a laser transparent support transferring the composite material to the acceptor substrate. This process enables the formation of adherent and uniform coatings at room temperature and atmospheric pressure with minimal post-deposition modification required, i.e., ≤400°C thermal processing. The firing of the laser and the work piece (substrate) motion is computer automated and synchronized using software designs from an electromagnetic modeling program validating that this technique is fully CAD/CAM compatible. The final properties of the deposited materials depend on the deposition conditions and the materials used, but when optimized, the properties are competitive with other thick film techniques such as screen-printing. Specific electrical results for conductors are < 5X the resistivity of bulk Ag, for BaTiO3/TiO2composite capacitors the k can be tuned between 4 and 100 and losses are < 1-4%, and for polymer thick film resistors the compositions cover 4 orders of magnitude in sheet resistivity. The surface profiles and fracture cross-section micrographs of the materials and devices deposited show that they are very uniform, densely packed and have minimum resolutions of -10 jtm. A discussion of how these results were obtained, the materials used, and methods to improve them will be given

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 624: Symposium V – Materials Development for Direct Write Technologies , 2000 , 143
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Chrisey, D.B. and Hubler, G.K. eds., Pulsed Laser Deposition of Thin Films, (New York, NY: Wily, Inc. 1994).Google Scholar
2 Method of producing a coating by matrix assisted pulsed laser evaporation, U.S. Pat. No. 6,025,036.Google Scholar
3 McGill, R.A., Chung, R., Chrisey, D.B., Dorsey, P.C., Matthews, P., Piqu, A., Mlsna, T.E., and Stepnowski, J.L., IEEE Trans. on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 45, p. 1370 (1998).Google Scholar
4 Piqu, A., Chrisey, D.B., Spargo, B.J., Bucaro, M.A., Vachet, R.W., Callahan, J.H., McGill, R.A., and Mlsna, T.E., in Advances in Laser Ablation of Materials, MRS Proceedings, vol. 526, p. 421, (1998).Google Scholar
5 Bohandy, J., Kim, B.F., and Adrian, F.J., J. Appl. Phys. 60 (1986) pp. 1538–1539.Google Scholar
6 Bohandy, J., Kim, B.F., Adrian, F.J., and Jette, A.N., J. Appl. Phys. 63 (1988) pp. 1158–1162.Google Scholar
7 Zergioti, I., Mailis, S., Vainos, N.A., Fotakis, C., Chen, S., Grigoropoulos, C.P., Appl. Surf. Sci. 127–129 (1998) pp. 601–605.Google Scholar
8 Adrian, F.J., Bohandy, J., Kim, B.F., Jette, A.N., and Thompson, P., J. Vac. Sci. Tech. B5 (1987) pp. 1490–1494.Google Scholar
9 Zergioti, I., Mailis, S., Vainos, N.A., Papakonstantinou, P., Kalpouzos, C., Grigoropoulos, C.P., and Fotakis, C., Appl. Phys. A 66 (1998) pp. 579–582.Google Scholar
10 Esrom, H., J-Y. Zhang, Kogelschatz, U., and Pedraza, A., Appl. Surf. Sci. 86, pp. 202–207 (1995).Google Scholar
11 Pimenov, S. M., Shafeev, G.A., Smolin, A.A., Konov, V.I., and Bodolaga, B.K., Appl. Surf. Sci. 86, pp. 208–212 (1995).Google Scholar
12 Piqu, A., Chrisey, D.B., Auyeung, R.C.Y., Fitz-Gerald, J.M., Wu, H.D., McGill, R.A., Lakeou, S., Wu, P.K., Nguyen, V. and Duignan, M., Appl. Phys. A 69, pp. S279–S (1999).Google Scholar
13 Chrisey, D.B., Piqu, A., Fitz-Gerald, J.M., Auyeung, R.C.Y., McGill, R.A., Wu, H.D., and Duignan, M., Appl. Surf Sci. 154, pp. 593–600 (2000).Google Scholar
14 Fitz-Gerald, J.M., Piqu, A., Chrisey, D.B., Rack, P.D., Zeleznik, M., Auyeung, R.C.Y., and Lakeou, S., Appl. Phys. Lett. 76, pp. 1386–1388 (2000).Google Scholar