Significant cost and timesavings can be realized by applying automated freeform fabrication techniques to the fabrication of ceramic electronic packaging. The widely used thick film/screen printing approach for ceramic packaging involves multiple separate processing stations to build up a multilayer package with embedded electrical connectivity. The current process steps include tape casting, conductor pattern screen-printing, punching/filling of vias, dicing, alignment and lamination. The development of low and high temperature co-fire ceramic systems (LTCC and HTCC) has streamlined the firing process, but significant inefficiencies remain in constructing the green state package, such that prototyping of ceramic packages is often very expensive with substantial lead times. This paper describes an integrated approach that combines the automated three-dimensional capabilities of stereolithography of ceramics and metals with the high resolution and precision of advanced photolithography systems. The process utilizes photocureable resins filled with sinterable ceramic and metal particles, which are applied layer-by-layer and photopatterned to build up a multilayer package. Materials development has focused on a glass-ceramic dielectric, a silver conductor and a barium titanate dielectric. Resin rheology and photocuring characteristics, thermal processing and sintered properties of the materials are described. A breadboard processing system was constructed and the results of fabricating test circuits are presented.