Hostname: page-component-848d4c4894-4hhp2 Total loading time: 0 Render date: 2024-05-17T18:36:11.829Z Has data issue: false hasContentIssue false

Computer Modelling of the Temperature Distribution in the Silicon Single Crystals During Growth and the Thermal History of the Crystal

Published online by Cambridge University Press:  28 February 2011

O. J. Anttila
Affiliation:
Helsinki University of Technology, Laboratory of Physical Metallurgy, SF-02150 Espoo, Finland
M. V. Tilli
Affiliation:
Okmetic Ltd., PB 44, SF-02631 Espoo, Finland
V. K. Lindroos
Affiliation:
Helsinki University of Technology, Laboratory of Physical Metallurgy, SF-02150 Espoo, Finland
Get access

Abstract

Computer modelling of the silicon single crystal grown by the Czochralski method has been carried out in order to calculate the temperature isotherms as well as to evaluate the thermal history of the crystal. The aim of the present work is to find out to which extent the thermal history of the crystal can be altered without structural modifications of the single crystal furnace. Furthermore, another aim is to study the influence of external heaters, reflectors and cooling elements to the temperature isotherms as well as to the form of the solid-melt interface. The model developed so far takes into account the crystal diameter and the pull rate as well as the radiation from the heater, the crucible and the melt. Furthermore, the inclusive study of the cooling effect of the inert gas flow is under progress.

Type
Research Article
Copyright
Copyright © Materials Research Society 1986

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Inoue, N., Osaka, J. and Wada, K., J. Electrochem. Soc. 129, 2780 (1982)CrossRefGoogle Scholar
2. Zulehner, W. and Huber, D., in Crystals 8, edited by Grabmaier, J. (Springer-Verlag, Berlin, Heidelberg, 1982), p. 1 Google Scholar
3. Jastrzebski, L., IEEE Trans. Electron Devices ED–29, 475 (1982); in Silicon Processing, edited by D.C. Gupta (ASTM, 1983), p. 309CrossRefGoogle Scholar
4. Fraundorf, G., Fraundorf, P., Craven, R.A., Frederick, R.A., Moody, J.W. and Shaw, R.W., J. Electrochem. Soc. 132, 1701 (1985)CrossRefGoogle Scholar
5. Abe, T., Kikuchi, K., Shirai, S. and Muraoka, S., in Semiconductor Silicon 1981, edited by Huff, H.R., Kriegler, R.J. and Takeishi, Y. (Electrochem. Soc., 1981), p. 54 Google Scholar
6. Ravi, K.V., Imperfections and Impurities in Semiconductor Silicon, (John Wiley & Sons, New York, 1981), p. 6264 Google Scholar
7. Ramachandran, P.A. and Dudukovic, M.P., J. Crystal Growth 71, 399 (1985)CrossRefGoogle Scholar
8. Williams, G. and Reusser, R.E., J. Crystal Growth 64, 448 (1983)CrossRefGoogle Scholar
9. Yaws, C.L., Dickens, L.L., Lutwack, R. and Hsu, G., Solid State Tech. Jan. 1981, 87Google Scholar
10. Rea, S.N., J. Crystal Growth 54, 267 (1981)CrossRefGoogle Scholar
11. Landolt-Börnstein III/17a, edited by Madelung, O. (Springer-Verlag, Berlin, Heidelberg, 1981), p. 77 Google Scholar
12. Brice, J.C., J. Crystal Growth 2, 395 (1968)CrossRefGoogle Scholar