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Configured Semiconductor/Insulator Coatings for Corrosion Prevention

Published online by Cambridge University Press:  21 February 2011

F. C. Jain
Affiliation:
University of Connecticut, Department of Electrical and Systems Engineering, 260 Glenbrook Road, U-157, Storrs, CT 06268
J. J. Rosato
Affiliation:
University of Connecticut, Department of Electrical and Systems Engineering, 260 Glenbrook Road, U-157, Storrs, CT 06268
K. S. Kalonia
Affiliation:
University of Connecticut, Department of Electrical and Systems Engineering, 260 Glenbrook Road, U-157, Storrs, CT 06268
V. S. Agarwala
Affiliation:
U. S. Naval Air Development Center, Warminster, PA 18974
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Abstract

Semiconductor and insulator coatings, appropriately configured in Metal-Semiconductor (MS) and Metal-Insulator (≈20–100Å)-Semiconductor (MIS) structural formats, are shown to result in the formation of a built-in active electronic barrier on metal surfaces. This interfacial electronic barrier impedes the transfer of electrons from the metal to oxidizing species present at the metal surface, thereby providing protection against corrosion. The effectiveness of the electronic barrier concept has been confirmed using weight-loss, and cathodic and anodic polarization measurements on aluminum samples coated with indium tin oxide ITO (semiconductor) and SiO2 (thin oxide/insulator) films. In particular, Al-ITO, Al-ITO-Si3N4, Al-SiO2-ITO, and Al-SiO2-ITO-Si3N4 structures were fabricated and tested in a 1% NaCl, pH-2 solution. The films were grown using chemical vapor deposition (CVD) and spray techniques to ensure high quality and reproducibility. Aluminum samples tested included commercial purity, high purity (polycrystalline and single crystalline), and alloy (7075-T6). The MS and MIS configurations were found to provide superior corrosion protection as compared to conventional insulating films (e.g., Al-Si3N4). The active electronic barrier approach is a generic methodology to inhibit corrosion, and it can be realized using other semiconductor/insulator combinations including semiconducting polymer coatings.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

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