Hostname: page-component-76fb5796d-x4r87 Total loading time: 0 Render date: 2024-04-25T17:24:11.031Z Has data issue: false hasContentIssue false

Contact Resistance and Methods for its Determination

Published online by Cambridge University Press:  15 February 2011

S. Simon Cohen*
Affiliation:
Signal Electronics Laboratory, General Electric Company, Corporate Research and Development, Schenectady, NY 12301, (U.S.A.)
Get access

Abstract

The problem of low resistance ohmic contacts to silicon has been of considerable technological interest. In recent years this problem has received special attention owing to the effect of scaling in very-large-scale integration (VLSI) technology. The field of ohmic contacts to semiconductors comprises two independent parts. First there exists the material science aspect. The choice of a suitable metallization system, the proper semiconductor parameters and the method of the contact formation is not obvious. Then there is the question of the proper definition of the contact resistance and the way it is measured.

Several methods for contact resistance determination have been introduced in the past. All seem to have some drawbacks that either limit their usefulness or raise doubts as to their validity in certain situations. We shall discuss the two-, three- and four-terminal resistor methods of measurement. Relevant theoretical considerations will also be included.

For conventional integrated circuits with a moderate junction depth of 1–2 μm, aluminum is uniquely suited as a single-element metallization system. However, for VLSI applications it may become obsolete because of several well-defined metallurgical problems. Thus, other metallization systems have to be investigated. We shall briefly discuss some recent data on several other metallization systems. Finally, the problem of size effects on the contact resistance will be discussed. Recent experimental results suggest important clues regarding the development of alternative metallization systems for VLSI circuits and also point to revisions of estimates of achievable design rules.

Type
Research Article
Copyright
Copyright © Materials Research Society 1982

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Chang, C. Y., Fang, Y. K. and Sze, S. M., Solid-State Electron., 14 (1971) 541.Google Scholar
2 Dennart, R. H., Gaensslen, F. H., Yu, H.-N., Rideout, V. L., Bassous, E. and LeBlanc, A. R., IEEE J. Solid-State Circuits, 9 (1974) 256.CrossRefGoogle Scholar
3 Paince, T. L., in Barbe, D. G. (ed.), Very Large Scale Integration, Springer, New York, 1980, p. 76.Google Scholar
4 Mayer, D. C., VLSI Design, 3 (1982) 50.Google Scholar
5 Schottky, W., Naturwissenschaften, 26 (1938) 843;CrossRefGoogle Scholar
5a Z. Phys., 113 (1939) 367.Google Scholar
6 Schottky, W. and Spenke, E., Wiss. Verdff. Siemens–Werken, 18 (1939) 225.Google Scholar
7 Mott, N. F., Proc. Cambridge Philos. Soc., 34 (1938) 568.Google Scholar
8 Bethe, H. A., Massachusetts Institute of Technology, Radiation Laboratory Rep. 43–12, 1942.Google Scholar
9 Schultz, W., Z. Phys., 138 (1954) 598.Google Scholar
10 Crowell, C. R. and Sze, S. M., Solid-State Electron., 9 (1966) 1035.Google Scholar
11 Duke, C. B., J. Vac. Sci. Technol., 7 (1970) 22.Google Scholar
12 Rideout, V. L., Solid-State Electron., 18 (1975) 541.Google Scholar
13 Crowell, C. R. and Rideout, V. L., Solid-State Electron., 12 (1969) 89;Google Scholar
13a Appl. Phys. Lett., 14 (1969) 85.CrossRefGoogle Scholar
14 Stratton, R. J., J. Phys. Chem. Solids, 23 (1962) 1177.Google Scholar
15 Padovani, F. A. and Stratton, R. J., Solid-State Electron., 9 (1966) 695.Google Scholar
16 Padovani, F. A., in Willardson, R. K. and Beer, A. C. (eds.), Semiconductors and Semimetals, Vol. 7, part A, Academic Press, New York, 1971.Google Scholar
17 Chang, C. Y. and Sze, S. M., Solid-State Electron., 13 (1970) 727.Google Scholar
18 Sullivan, M. V. and Eigler, J. H., J. Electrochem. Soc., 103 (1956) 218.Google Scholar
19 Berger, H. H., J. Electrochem. Soc., 119 (1972) 507.Google Scholar
20 Cox, R. H. and Strack, H., Solid-State Electron., 10 (1967) 1213.Google Scholar
21 Edwards, W. D., Hartman, W. A. and Torrens, A. B., Solid-State Electron., 15 (1972) 387.Google Scholar
22 Shepela, A., Solid-State Electron., 16 (1973) 477.Google Scholar
23 Heime, K., König, V., Kohn, E. and Wortmann, A., Solid-State Electron., 17 (1974) 835.Google Scholar
24 Robinson, G. Y., Solid-State Electron., 18 (1975) 331.Google Scholar
25 Muta, H., Jpn. J. Appl. Phys., 17 (1978) 1089.Google Scholar
26 Braslau, N., J. Vac. Sci. Technol., 19 (1981) 830.Google Scholar
27 Brooks, R. D. and Matthes, H. G., Bell. Syst. Tech. J., 50 (1971) 775.CrossRefGoogle Scholar
28 Wittmer, M. and Seidel, T. E., J. Appl. Phys., 49 (1979) 5827.Google Scholar
29 Schumann, P. A. Jr., and Gardner, E. E., Solid-State Electron., 12 (1969) 371.Google Scholar
30 Sinha, A. K., J. Electrochem. Soc., 120 (1973) 1767.Google Scholar
31 Ting, C.-Y. and Chen, C. Y., Solid-State Electron., 14 (1971) 433.Google Scholar
32 Shockley, W., Rep. AI–TOR–64–207, 1964 (Air Force Atomic Laboratory, Wright–Patterson Air Force Base, OH).Google Scholar
33 Yu, A. Y. C., Solid-State Electron., 13 (1970) 239.Google Scholar
34 Hower, P. L., Hooper, W. W., Cairns, B. R., Fairman, R. D. and Tremere, D. A. in Willardson, R. K. and Beer, A. C. (eds.), Semiconductors and Semimetals, Vol. 7, part A, Academic Press, New York, 1971.Google Scholar
35 Reeves, G. K. and Harrison, H. B., IEEE Electron Device Lett., 3 (1982) 111.CrossRefGoogle Scholar
36 Kennedy, D. P. and Murley, P. C., IBM J. Res. Dev., 12 (1968) 242.Google Scholar
37 Murrmann, H. and Widmann, D., Dig. Tech. Papers, Int. Solid State Circuits Conf., San Francisco, 1969, IEEE Electron Device Society, 1969, p. 162.Google Scholar
38 Murrmann, H. and Widmann, D., Solid-State Electron., 12 (1969) 879.Google Scholar
39 Murrmann, H. and Widmann, D., IEEE Trans. Electron Devices, 16 (1969) 1022.Google Scholar
40 Berger, H. H., Dig. Tech. Papers, Int. Solid State Circuits Conf., San Francisco, 1969, IEEE Electron Device Society, 1969, p. 160.Google Scholar
41 Berger, H. H., Solid-State Electron., 15 (1972) 145.Google Scholar
42 Chang, I. F., J. Electrochem. Soc., 117 (1970) 369.Google Scholar
43 Finetti, M., Ostoja, P., Solmi, S. and Soncini, G., Solid-State Electron., 23 (1980) 255.Google Scholar
44 Marlow, G. S. and Das, M. B., Solid-State Electron., 25 (1982) 91.Google Scholar
45 Cohen, S. S., Gildenblat, G. and Brown, D. M., J. Electrochem. Soc., 130 (1983) 978.Google Scholar
46 Cohen, S.S., unpublished results, 1981.Google Scholar
46a Braslau, N., personal communication, 1982.Google Scholar
47 Cohen, S. S., Gildenblat, G., Ghezzo, M. and Brown, D. M., J. Electrochem. Soc., 129 (1982) 1335.Google Scholar
48 McNeil, G., in Schwartz, B. (ed.), Ohmic Contacts to Semiconductors, Electrochemical Society, Princeton, NJ, 1969, p. 305.Google Scholar
49 Shih, K. K. and Blum, J. M., Solid-State Electron., 15 (1972) 1177.Google Scholar
50 Anderson, R. M. and Rieth, T. M., J. Electrochem. Soc., 122 (1975) 1337.Google Scholar
51 Beuhler, M. G., in Semiconductor Measurement Technology, NBS Spec. Publ. 400–22, 1976 (National Bureau of Standard, U.S. Department of Commerce).Google Scholar
52 Cohen, S. S., Gildenblat, G. and Brown, D. M., Proc. Electrochemical Society Annu. Meet., Montreal, May 1982, Electrochemical Society, Pennington, N.J.Google Scholar
53 Proctor, S. J. and Linholm, L. W., Proc. Electrochemical Society Annu. Meet., Montreal, May 1982, Electrochemical Society, Pennington, NJ, 1982.Google Scholar
54 Black, J. R., Proc. IEEE, 57 (1969) 1587.CrossRefGoogle Scholar
55 Card, H. C., IEEE Trans. Electron Devices, 23 (1976) 538.Google Scholar
56 Ghate, P. B., Blair, J. C. and Fuller, C. R., Thin Solid Films, 45 (1977) 69.Google Scholar
57 Sello, H. in Ohmic Contacts to Semiconductors, Electrochemical Society, Princeton, NJ, 1969, p. 277.Google Scholar
58 Chino, K., Solid-State Electron., 16 (1973) 119.Google Scholar
59 Basterfield, J., Shanon, J. M. and Gill, A., Solid-State Electron., 18 (1975) 290.Google Scholar
60 Card, H. C., Solid-State Commun., 16 (1975) 87.Google Scholar
61 Cohen, S. S., Piacente, P. A., Gildenblat, G. and Brown, D. M., J. Appl. Phys., 53 (1982) 8856.CrossRefGoogle Scholar
62 Yanagawa, F., Amazawa, T. and Oikawa, H., Jpn. J. Appl. Phys., Suppl. 1, 18 (1979) 237.Google Scholar
63 Mochizuki, T., Tsujimaru, T., Kashiwagi, M. and Nishi, Y., IEEE Trans. Electron Devices, 27 (1980) 1431.Google Scholar