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Depth Dependence of Residual Strains in Textured Mo Thin Films Using High-Resolution X-Ray Diffraction

Published online by Cambridge University Press:  15 February 2011

S. G. Malhotra
Affiliation:
Univ. of Michigan Dept. of Materials Science and Engineering, Ann Arbor, MI 48109
Z. U. Rek
Affiliation:
Univ. of Michigan Dept. of Materials Science and Engineering, Ann Arbor, MI 48109 SSRL, Stanford, CA 94395
S. M. Yalisove
Affiliation:
Univ. of Michigan Dept. of Materials Science and Engineering, Ann Arbor, MI 48109
J. C. Bilello
Affiliation:
Univ. of Michigan Dept. of Materials Science and Engineering, Ann Arbor, MI 48109
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Abstract

The magnitude of the average stress in a thin film can be obtained by measuring the curvature of the film-substrate couple. However, the details of the strain distribution, as a function of depth through the thickness of the film, can have important consequences in governing film quality and ultimate morphology. A high-resolution x-ray diffraction method was used to determine the depth dependence of strain in a textured Mo film, with a nominal thickness of 260 nm, which was deposited by planar magnetron sputtering onto Si (100) substrates. The principal strains, resolved onto a laboratory reference frame, displayed a negligible gradient in the azimuthal directions (x and y), but displayed a large gradient in the direction normal to the film (z). A similar trend was previously observed for a 100 nm polycrystalline film, but the magnitude of the normal strain very near the free surface was about a factor of 2 less. The increase in the normal strain may be due to the development of a preferred growth direction and grain facetting. A linear elastic model was also used to determine the strains in successive slabs of the film, where strain variations between slabs were indicated.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

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