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Dielectric Properties of Amorphous Carbon Nitride Films

Published online by Cambridge University Press:  10 February 2011

M. Aono
Affiliation:
Department of Electrical Engineering, Gifu University, Gifu, 501-1193, JAPAN
T. Katsuno
Affiliation:
Department of Electrical Engineering, Gifu University, Gifu, 501-1193, JAPAN
S. Nitta
Affiliation:
Department of Electrical Engineering, Gifu University, Gifu, 501-1193, JAPAN
T. Itoh
Affiliation:
Department of Electrical Engineering, Gifu University, Gifu, 501-1193, JAPAN
S. Nonomura
Affiliation:
Department of Electrical Engineering, Gifu University, Gifu, 501-1193, JAPAN
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Abstract

Dielectric properties of amorphous carbon nitride films made by the layer-by-layer method, (LLa-CNx) consisting of a cyclic process with (A) the deposition of an amorphous carbon nitride layer by sputtering and with (B) the etching by atomic hydrogen, have been compared with that of amorphous carbon nitride (a-CNx) films prepared without the hydrogen etching process. It is found that the nitrogen in a-CNx and LLa-CNx could decrease the refractive index n and the dielectric constant ε at 1 MHz. The nitrogen could create less dense structure in a-CNx and LLa-CNx compared to diamond-like carbon (DLC). The sp3 bonds between carbon atoms seem to increase by the atomic hydrogen treatment in LLa-CNx. The refractive index of LLa-CNx increases with sp3content. Preliminary experiments adding oxygen in amorphous carbon nitride to create a-CNxOy film are tried and discussed briefly.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

[1]Low-Dielectric Constant Materials IV”, edited by Chiang, C., Ho, P. S., Lu, T. M., Wetzel, J. T. (Mater. Res. Soc. Proc. 511, San Francisco, CA, 1998).Google Scholar
[2] Aono, M., Nitta, S., Iwasaki, T., Yokoi, H., Itoh, T., Nonomura, S., “Low-Dielectric Constant Materials V”, (Mater. Res. Soc. Proc. 565, San Francisco, CA, 1999) pp. 291296.Google Scholar
[3] Nitta, S., Takada, N., Sugiyama, K., Itoh, T. and Nonomura, S., J. Non-Cryst. Solids, 227–230, 655658 (1997).Google Scholar
[4] Aono, M., Nitta, S. Katsuno, T., Itoh, T. and Nonomura, S., Appl. Surface Science, in print.Google Scholar
[5] Lieber, C. M. and Zhang, Z. J., Chemistry & Industry, 20, 922 (1995).Google Scholar
[6] Santos, M. C. dos and Alvarez, F., Phys. Rev. B 58, 13918 (1998).Google Scholar
[7] Alvarez, F. and Santos, M. C. dos, preprint.Google Scholar
[8] Naruse, Y., The Graduation Research Thesis for Bachelor, (Gifu University, Spring of 2000), preprint.Google Scholar
[9] Ferrari, A. C., Kleinsorge, B., Adamopoulos, G., Robertson, J., Milne, W. I., Stojolan, V., Brown, L. M., LiBassi, A., Tanner, B. K., preprint.Google Scholar
[10] Robertson, J., Philosophical Magazine B, Vol. 76, No. 3, 335350 (1997).Google Scholar