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Effect of Copper Film Thickness on Stress and Strain in Grains of Different Orientation

Published online by Cambridge University Press:  21 February 2011

R. P. Vinci ,
E. M. Zielinski  and
J. C. Bravman
R. P. Vinci
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305-2205
E. M. Zielinski
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305-2205
J. C. Bravman
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305-2205
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Abstract

Models describing the effect of grain orientation on dislocation glide in a thin film are reviewed; it is predicted that differences in stress-temperature behavior should exist between grains of different orientation in a polycrystalline copper film. Direct x-ray evaluation of strains in {111} and {100| grains within primarily {111} textured copper films shows that these stresses are film thickness or grain size dependent. The {111} oriented grains behave as expected, with room temperature flow stress increasing linearly with 1/film thickness. The flow stress of grains of {100} orientation, however, is approximately constant with film thickness and is not well represented by the models. It is proposed that simplifying assumptions about orientation dependent yield may only be appropriate for the majority grain orientation population in a textured film.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 459
Copyright
Copyright © Materials Research Society 1995

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References

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