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Effect of Processing Conditions on the Surface Morphology of thin Polysilicon Films Used for Dram Cell Capacitors

Published online by Cambridge University Press:  15 February 2011

Viju K. Mathews*
Affiliation:
Micron Technology, Inc., Boise, ID 83706.
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Abstract

The surface texture of polysilicon films, used for capacitor storage nodes, have been investigated for various deposition conditions. An increase in capacitance of approx. 70% has been observed in this work. The reproducibility of the surface texture and the resulting capacitance can be improved by optimizing the deposition pressure. The gain in capacitance was also observed to be affected by the thickness of the film. In the mass flow controlled regime the increase in capacitance was 12%. The increase in surface roughness and the gain in capacitance for the hot wall process provides a simple alternative for satisfying the charge capacity requirements in high density dynamic random access memories.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

1. Lu, N. C. C., IEEE Circ. Dev. Mag., Vol.5, No. 1, 27(1989).Google Scholar
2. Wakamiya, W., Tanaka, Y., Kimura, H., Miyatake, H., and Satoh, S., Symp. on VLSI Tech., Digest of Technical papers, 69 (1989).Google Scholar
3. Shinriki, H., Nishioka, Y., Ohji, Y., and Mukai, K., IEDM Tech. Digest, 684 (1986).Google Scholar
4. Fazan, P. C., and Lee, R. R., IEEE Trans. Electron Dev., EDL-II, 279 (1990).Google Scholar
5. Mine, T., Iijima, S., Yugami, J., Ohga, K. and Morimoto, T., Ext. Abs. 21st Conf. on SSDM, 137 (1989).Google Scholar
6. Mathews, V. K. and Yu, C., Ext. Abs. 179th ECS Meeting, Vol.91–1, No. 374, 565(1991).Google Scholar
7. Bisaro, R., Magarino, J., Proust, N., and Zellama, K., J. Appl. Phys., 59 (4), 1167 (1986)Google Scholar
8. Sakao, M., Kasai, N., Ishijima, T., Ikawa, E., Terada, K. and Kikkawa, T., IEDM Tech. Digest., 655 (1990).Google Scholar
9. Watanabe, H., Aoto, N., Adachi, S., Ishijama, T., Ikawa, E. and Terada, K., Appl. Phys. Lett., Vol.58, No. 3, 251 (1991).Google Scholar
10. Mathews, V. K., Fazan, P. C., Sandhu, G. S., Ditali, A. and Rhodes, H. R., Ext. Abs. 179th ECS Meeting, Vol.91–1, No. 375, 567 (1991).Google Scholar
11. Joubert, P., Loisel, B., Chouan, Y., Haji, L., J. Elec. Soc., Vol.134, No. 10, 2541 (1987).Google Scholar
12. Kamins, T. I. and Cass, T. R., Thin Solid Films, Vol.16, 147 (1973).Google Scholar
13. Chan, H. C., Mathews, V. K. and Fazan, P. C., to be published in IEEE Electron Device Letters.Google Scholar
14. Fazan, P. C., Mathews, V. K., Chan, H. C. and Ditali, A., to be published in Applied Physics Letters.Google Scholar