Hostname: page-component-76fb5796d-vvkck Total loading time: 0 Render date: 2024-04-29T13:30:49.823Z Has data issue: false hasContentIssue false

Enhancement of the Electrical Properties of BaTiO3 Films on GaAs Using Double Layer Structures

Published online by Cambridge University Press:  15 February 2011

L.H. Chang
Affiliation:
State University of New York at Buffalo, Center of the Electronic and Electro-Optic Materials, Department of Electrical and Computer Engineering, Bonner Hall, Buffalo, NY 14260
W.A. Anderson
Affiliation:
State University of New York at Buffalo, Center of the Electronic and Electro-Optic Materials, Department of Electrical and Computer Engineering, Bonner Hall, Buffalo, NY 14260
Get access

Abstract

Ferroelectric BaTiO3 thin films have been directly deposited on n-GaAs with carrier concentration of 5.3–8.2×1017/cm2. The BaTiO3 thin films with a thickness in the range of 80–120 nm were prepared by RF magnetron sputtering with a substrate temperature of 300°C. The as-deposited BaTiO3 films appeared to be amorphous with relative dielectric constants of around 15 and gave flat capacitance-voltage (C-V) curves, indicating poor interface properties and very high oxide charge density. After rapid thermal annealing (RTA) at 800°C for 60 sec, the relative dielectric constant of the BaTiO3 film increased to 82 and a sharp C-V curve was observed with oxide charge density of about 7×1012/cm2. However, the leakage current density increased from 4×10'11 A/cm2 for as-deposited BaTiO3 to 2×105 A/cm2 for RTA(800°C)-BaTiO3 at a field of 4×105 V/cm. By taking advantage of the best properties from both as-deposited amorphous BaTiO3 films (low leakage current density) and RTA(800°C)-BaTiO3 (high dielectric constant) the double layer structure was designed to enhance the electrical properties of the BaTiO3 films on GaAs. The most promising results in regards to the dielectric property and leakage current density are 76.5 and 9.7×109 A/cm2, respectively, for the double layer RTA(500°C)-BaTiO3 on RTA(800°C)-BaTiO3 structures.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Park, L.H. and Tasch, A.F., IEEE Circuits and Devices Mag. p17, Jan. (1990)Google Scholar
2. Fazan, P.C., Integrated Ferroelectics 4, 247 (1994)Google Scholar
3. Jia, Q.X., Chang, L.H., and Anderson, W.A., J. Mater. Res., 9, 2561 (1994)Google Scholar
4. Yeh, M.H., Liu, Y. C., Liu, K.S., Lin, I.N., and Lee, J.Y.M., J. Appl. Phys., 74, 2143 (1993)Google Scholar
5. Chang, L.H., Jia, Q.X., and Anderson, W.A., summited to Thin Solid FilmsGoogle Scholar
6. Li, P. and Lu, T.M., Appl. Phys. Lett. 57, 2336 (1990)Google Scholar
7. Jia, Q.X., Chang, L.H., and Anderson, W.A., J. Electron. Mater., 23, 551 (1994)Google Scholar
8. Dharmadhikari, V.S. and Grannemann, W.W., J. Appl. Phys. 53, 8988 (1982)Google Scholar
9. Chang, L.H. and Anderson, W.A., presented at the 36th electronic Materials Conf., Boulder, Colorado, June 22–24, 1994 Google Scholar
10. Chang, L.H., Jia, Q.X., and Anderson, W.A., Proc. MRS 318 (1993)Google Scholar