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Eutectic Bonding of Copper to Ceramics

Published online by Cambridge University Press:  22 February 2011

Marc Wittmer
Marc Wittmer*
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
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Abstract

Eutectic bonding of copper to ceramics makes use of a liquid eutectic between copper and oxygen at 1065°C which wets oxide ceramics very well. Upon solidification of the eutectic melt a very strong bond is established which has a strength of about 5×107N/m2. The excellent bond strength gives this technique important applications in electronic packaging and mechanical engineering.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 393
Copyright
Copyright © Materials Research Society 1985

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