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Film Fracture Phenomena During Indentation

Published online by Cambridge University Press:  17 March 2011

D.F. Bahr
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman, WA 99164-2920
M. Pang
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman, WA 99164-2920
D. Rodriguez-Marek
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman, WA 99164-2920
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Abstract

Discontinuities during both load and depth controlled continuous indentation tests have been ascribed to dislocation nucleation or multiplication and film fracture. In materials which exhibit permanent deformation prior to a discontinuity in loading, it is more likely that the phenomena is indeed controlled by film fracture, and not the rapid generation of dislocations. The current study has been undertaken to examine the properties of passivating films on engineering alloys. An electrochemical cell coupled with a scanning probe microscope and nanoindentation system allows growth and mechanical testing of passive films on an austenitic stainless steel as well as a titanium alloy. A complementary set of ex situ experiments shows the presence of deformation prior to film fracture with both load – depth sensing techniques as well as imaging the surface topography. The occurrence of excursions is shown in these materials to be linked directly with film fracture, rather than dislocation multiplication.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1. Page, T.F. and Hainsworth, S.V., Surf. Coatings Tech., 67, 305 (1993).Google Scholar
2. Asif, S.A. Syed and Pethica, J.B., Philos. Mag. A, 76, 1105 (1997).Google Scholar
3. Mann, A.B. and Pethica, J.B., Appl. Phys. Lett., 69, 907 (1996).Google Scholar
4. Kiely, J.D. and Houston, J.E., Phys. Rev. B, 57, 12588 (1998)Google Scholar
5. Bahr, D.F., Hoehn, J.W., Moody, N.R. and Gerberich, W.W., Acta Mater., 45, 5163 (1997).Google Scholar
6. Bahr, D.F., Kramer, D.E., and Gerberich, W.W., Acta Mater., 46, 3605 (1998).Google Scholar
7. Corcoran, S.G., Colton, R.J., Lilleodden, E.T., and Gerberich, W.W., Phys. Rev. B., 55, R160 57 (1997).Google Scholar
8. Weppelmann, E. and Swain, M.V., Thin Solid Films, 286, 111 (1996).Google Scholar
9. Hertz, H., Miscellaneous papers by Heinrich Hertz, ed. Jones, D.E. and Schott, G.A., MacMillan, London, (1896), pp. 163183.Google Scholar
10. Johnson, K. L., Contact Mechanics, Cambridge University Press, (1985).Google Scholar
11. Kramer, D., Huang, H., Kriese, M., Robach, J., Nelson, J., Wright, A., Bahr, D., and Gerberich, W.W., Acta Mater., 47, 333 (1999).Google Scholar
12. Gerberich, W. W., Strojny, A., Yoder, K., and L-S, Cheng, J. Mater. Res., 14, 2211(1999).Google Scholar
13. Timoshenko, S. and Woinowshy-krieger, S., “Theory of Plates and Shells”, McGraw-Hill, (1959).Google Scholar