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Glancing Angle X-Ray Analysis of Titanium Copper Compound Formations

Published online by Cambridge University Press:  22 February 2011

P. A. Psaras  and
D. Gupta
P. A. Psaras
Affiliation:
IBM Thomas J. Watson Research Center Yorktown Heights, N.Y. 10598
D. Gupta
Affiliation:
IBM Thomas J. Watson Research Center Yorktown Heights, N.Y. 10598
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Abstract

Titanium copper compound formations have been studied via Seeman Bohlin x-ray diffractometry and Rutherford backscattering spectrometry. The heat treatment temperature range was 350°C to 475°C and th heat treatment times ranged from 0 to 240 minutes. Tetragonal gamma TiCu formed first at ˜350°C and was sequentially followed by orthorhombic TiCu3 at ˜400°C. From Rutherford backscattering spectrometry analysis it was concluded that the second TiCu3 compound deviated from ideal stoichiometry to a nonstoichiometric Ti0.88Cu3.12 composition

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 145
Copyright
Copyright © Materials Research Society 1985

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References

1. Tu, K.N. and Mayer, J.W., Chapter 10, “Thin Films Interdiffusion and Reactions”, Editors Poate, J.M., Tu, K.N. and Mayer, J.W., John Wiley and Sons, New York (1978).Google Scholar
2. Ottaviani, G., J. Vac. Sci. Technol. 16, 112 (1979).Google Scholar
3. Crowder, B.L. and Zirinsky, S., IEEE, Trans. Electron. Devices ED–26, 369 (1979).CrossRefGoogle Scholar
4. Murarka, S.P. and Frazer, D.B., J. Appl. Phys. 51, 342 (1980).Google Scholar
5. Nicolet, M.-A., Thin Solid Films, 52, 415 (1978).Google Scholar
6. Morabito, J.M., Thomas, J.H. and Lesh, N.G., IEEE Trans. on Parts, Hybrids and Packaging, PHP 11, (1975).CrossRefGoogle Scholar
7. Nowicki, R.S., Harris, J.M., Nicolet, M.A., and Mitchell, J.V., Thin Solid Films, 60, 237 (1979).Google Scholar
8. Krafesik, I., Gyulas, J., Palmstron, C.J. and Mayer, J.W., Appl. Phys. Lett., 43, 1015 (1983).Google Scholar
9. Ting, C.Y., and Crowder, B.L., J. Electrochem. Soc., 129, 2590 (19882).CrossRefGoogle Scholar
10. Gershinskii, A.E., Khoromenko, A.A. and Cherepov, E.I., Phys. Stat. Sol (a), 31, 61 (1975).CrossRefGoogle Scholar
11. Schatt, W., Ullrich, H.J., Kleinstuck, K., Dabritz, S., Herenz, A., Bergner, D. and Luck, H., Kristall and Technik 13, 185 (1978).Google Scholar
12. Moffatt, W. G, Volume 2, “The Handbook of Binary Phase Diagrams”, General Electric Corporation, New York (1981).Google Scholar
13. Feder, R. and Berry, B.S., J. Appl. Crystallogr. 3, 372 (1970).Google Scholar
14. Chu, W.K., Mayer, J.W. and Nicolet, M.A., “Backscattering Spectrometry”, Academic Press, New York (1978).Google Scholar
15. Mayer, O., Linter, G. and Kappder, F., editors, Chapter 2 “Ion Beam Surface Layers Analysis, Plenum Press, New York (1976).Google Scholar
16. Liotard, J.L., Gupta, D., Psaras, P.A. and Ho, P.S., J. Appl. Phys. in press (1985).Google Scholar
17. McClune, W.F., editor, “Powder Diffraction Inorganic Phases”, File No. 05–0682, JCPDS Intl. Center for Diffraction Data, Pennsylvania (1982).Google Scholar
18. McClune, W.F., editor, “Powder Diffraction Inorganic Phases”, File No. 05–0682, JCPDS Powder Diffraction Inorganic Phases File No. 04–0836.Google Scholar
19. McClune, W.F., editor, “Powder Diffraction Inorganic Phases”, File No. 05–0682, JCPDS Powder Diffraction Inorganic Phases File No. 07–0114.Google Scholar
20. McClune, W.F., editor, “Powder Diffraction Inorganic Phases”, File No. 05–0682, JCPDS Powder Diffraction Inorganic Phases File No. 20–0371.Google Scholar