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Grain Growth Behavior of Bismuth Titanate Thin Film on Metallic Silicon Substrates

Published online by Cambridge University Press:  21 February 2011

Yanxia Lu
Affiliation:
NYS College of Ceramics, Alfred University, Alfred, NY 14802
Walter A. Schulze
Affiliation:
NYS College of Ceramics, Alfred University, Alfred, NY 14802
David T. Hoelzer
Affiliation:
NYS College of Ceramics, Alfred University, Alfred, NY 14802
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Abstract

Bismuth titanate (Bi4Ti3O12) thin films were produced from acetate precursors by spin coating deposition followed by crystallization using rapid thermal processing (RTP)‥ Crystallographic orientation was characterized by x-ray diffraction, and indicated that it varied with the number of coating layers for the films deposited on single crystal silicon wafers. Cross sectional samples were prepared and studied by Transmission Electron Microscopy (TEM). The results showed that grains randomly nucleated at the interface where a thin amorphous silica layer was naturally formed. Grains nucleated in the [020] direction or near this direction showed a faster growth rate than that in the other directions, and eventually dominant in determining the grain orientation of the film. Preferential orientation in the [020] direction observed by TEM is identical to the XRD results for the multilayer thin films. The thickness and grain size of thin film were also investigated.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1 Aurivillius, B., Ariciv. Kemi, 1[54], 463 (1949);Google Scholar
Aurivillius, B., Ariciv. Kemi, 1[58], 449 (1949);Google Scholar
Aurivillius, B., Ariciv. Kemi, 2[37], 519 (1950).Google Scholar
2 Cummins, S. E. and Cross, L. E., J, of Applied Physics, 39[5], April, 22682274 (1968).Google Scholar
3 Subbarao, E. C., Phy. Rev., 122 [3], 804807 (1961).Google Scholar
4 Doman, J. F., Newnham, R. E. and Smith, D. K., Ferroelectrics, 3, 1727 (1971).Google Scholar
5 Buhay, H., Sinharoy, S., Francombe, M. H., Kasner, W. H., Talvacchio, J., Park, B. K. and Doyle, N. J., Proc. Inter. Symp. on Integr. Ferro, 3rd (1, 1991. pp. 62.Google Scholar
6 Wang, H., Fu, L. W., Yu, S. Q., Wang, X. L., Lu, Z. K. and Jing, M. M., Ferroelectrics thin films II, 243, 213216 (1992).Google Scholar
7 Dayalan, Ethirajulu, Peng, Chien H., and Desu, Seshu B., Ceramic Transactions, 25, 279291 (1992).Google Scholar
8 Lu, Y., Hoelzer, D. T., Walter, W. A., Sympo. Proc. of ISFA 9th, August, 1994 Google Scholar
9 Kingery, W. D., Introduction to Ceramics. 2nd ed. (John Wiley & Sons, New York, 1976) p. 179.Google Scholar