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Grain Growth Behaviour Of Nanocrystalline Nickel

Published online by Cambridge University Press:  25 February 2011

A. M. El-Sherik ,
K. Boylan ,
U. Erb ,
G. Palumbo  and
K. T. Aust
A. M. El-Sherik
Affiliation:
Department of Materials and Metallurgical Engineering, Queen's University, Kingston, Canada, K7L 3N6.
K. Boylan
Affiliation:
Department of Materials and Metallurgical Engineering, Queen's University, Kingston, Canada, K7L 3N6.
U. Erb
Affiliation:
Department of Materials and Metallurgical Engineering, Queen's University, Kingston, Canada, K7L 3N6.
G. Palumbo
Affiliation:
Ontario Hydro Research Division, 800 Kipling Avenue, Toronto, CanadaM8Z 5S4.
K. T. Aust
Affiliation:
Department of Metallurgy and Materials Science, University of Toronto, Toronto, CanadaM5S 1A4.
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Abstract

The thermal stability of electrodeposited nanocrystalline Ni-1.2%P and Ni-0.12%S alloys is evaluated by in-situ electron microscopy studies. Isothermal grain size versus annealing time curves at 573K and 623K show an unexpected thermal stabilization in form of a transition from rapid initial grain growth to negligible grain growth. This behaviour is discussed in terms of the various grain boundary drag mechanisms which may be operative in these alloys.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 238: Symposium Cb – Structure and Properties of Interfaces in Materials , 1991 , 727
Copyright
Copyright © Materials Research Society 1992

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References

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