Hostname: page-component-848d4c4894-x24gv Total loading time: 0 Render date: 2024-05-17T20:19:21.814Z Has data issue: false hasContentIssue false

Improvement of Temperature Uniformity in Rapid Thermal Processing Systems Using Multivariable Control1

Published online by Cambridge University Press:  28 February 2011

S. A. Norman
Affiliation:
Stanford University, Dept. of Electrical Engineering, Stanford CA 94305.
C. D. Schaper
Affiliation:
Stanford University, Dept. of Electrical Engineering, Stanford CA 94305.
S. P. Boyd
Affiliation:
Stanford University, Dept. of Electrical Engineering, Stanford CA 94305.
Get access

Abstract

During rapid thermal processing (RTP) of a semiconductor wafer, maintenance of nearuniform wafer temperature distribution is necessary. This paper addresses the problem of insuring temperature uniformity in a cylindrical RTP system with multiple concentric circular lamps.

A numerical technique is presented for optimizing steady-state temperature distribution by independently varying the power radiated by each lamp. It is shown for a simulated system, over a wide range of temperature setpoints, that the temperature uniformity achievable with multivariable (“multiple knob”) control of lamp powers is significantly better than that achievable with scalar (“single knob”) control.

The difficulties of using scalar control in RTP are more severe in the case of temperature trajectory design than in the case of steady-state temperature maintenance. For example, with scalar control the rate of temperature increase during ramping is limited because temperature nonuniformity can cause slip defects in the wafer. A numerical technique is presented for designing multivariable lamp power trajectories to obtain near-optimal temperature uniformity while wafer temperature tracks a specified ramp, resulting in slip-free ramp rates much faster than those achievable with scalar control.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

1

This research was supported by the Advanced Research Projects Agency of the Department of Defense and was monitored by the Air Force Office of Scientific Research under Contract No. F49620-90-0-0014. This manuscript is submitted for publication with the understanding that the US Government is authorized to reproduce and distribute reprints for Government purposes notwithstanding any copyright notation hereon.

The views and conclusions contained in this document are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either express or implied, of the Advanced Research Projects Agency or the U.S. Government.

References

1. Lord, H. A., IEEE Trans. Semicond. Manufact., 1(3):105114 (1988).Google Scholar
2. Sparrow, E. M. and Cess, R. D., Radiation Heat Transfer. (Hemisphere Publishing, 1978).Google Scholar
3. Gyurcsik, R. S., Riley, T. J., and Sorrell, F. Y., IEEE Trans. Semicond. Manufact., 4(1):913, (1991).Google Scholar
4. Apte, P. P., Wood, S., Saraswat, K. C., and Moslehi, M. M., in Rapid Thermal and Integrated Processing (Mater. Res. Soc. Proc., 1991).Google Scholar
5. Hill, C., Jones, S., and Boys, D., in Reduced Thermal Processing for ULSI, edited by Levy, R. A. (Plenum Press, 1988), pp. 143180.Google Scholar
6. Kakoschke, R. and Buftmann, R., in Rapid Thermal Annealing (Mater. Res. Soc. Proc. 146, 1989), pp. 473482.Google Scholar
7. Young, G. M. and McDonald, K. A., IEEE Trans. Semicond. Manufact., 3(4):176182, (1990).Google Scholar
8. Gyurcsik, R. S., in Proc. SRC Workshop on Real-Time Tool Controllers, edited by Burke, J. R. and McMahon, R. (Semiconductor Research Corporation, 1991), pp. 109133.Google Scholar
9. Bentini, G., Correra, L., and Donolato, C., J. Appl. Phys., 56(10):29222929 (1984).Google Scholar
10. Campbell, S. A., Ahn, K.-H., Knutson, K. L., Liu, B. Y. H., and Leighton, J. D., IEEE Trans. Semicond. Manufact., 4(1):1420 (1991).Google Scholar
11. Norman, S. A., Optimization of Wafer Temperature Uniformity in Rapid Thermal Processing Systems (Stanford Univ. Information Systems Lab. Tech. Report, 1991).Google Scholar