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Laser Assisted Seeding for Electroless Plating on Insulators

Published online by Cambridge University Press:  01 January 1992

A.G. Schrott ,
B. Braren ,
E.J.M. O'sullivan  and
R.F. Saraf
A.G. Schrott
Affiliation:
IBM Research Division, T.J. Watson Res. Ctr. Yorktown Heights, NY 10598
B. Braren
Affiliation:
IBM Research Division, T.J. Watson Res. Ctr. Yorktown Heights, NY 10598
E.J.M. O'sullivan
Affiliation:
IBM Research Division, T.J. Watson Res. Ctr. Yorktown Heights, NY 10598
R.F. Saraf
Affiliation:
IBM Research Division, T.J. Watson Res. Ctr. Yorktown Heights, NY 10598
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Abstract

Excimer laser pulses with wavelengths of 248 and 308 nm were used to selectively seed Pd on SiO2 surfaces, making them suitable for electroless plating. This novel seeding process for insulating materials is accomplished with the sample immersed in the seeding solution, and occurs only on the areas of the substrate that are illuminated (through the liquid) by the laser light. The Pd content of the seeded samples increased with the number of pulses, but was rather independent of repetition rate. The deposition rate showed a dependence with wavelength consistent with a defect driven mechanism for electron excitation through the band gap of SiO2. These electrons then reduce the Pd ions in the solution in contact with the surface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 285: Symposium I – Laser Ablation in Materials Processing–Fundamentals and Applications , 1992 , 197
Copyright
Copyright © Materials Research Society 1993

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References

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