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Mechanical Behavior of Eutectic Sn-Ag and Sn-Zn Solders

Published online by Cambridge University Press:  21 February 2011

Hareesh Mavoori ,
Semyon Vaynman ,
Jason Chin ,
Brian Moran ,
Leon M. Keer  and
Morris E. Fine
Hareesh Mavoori
Affiliation:
Dept. of Materials Science & EngineeringNorthwestern University, Evanston, IL 60208
Semyon Vaynman
Affiliation:
Dept. of Materials Science & EngineeringNorthwestern University, Evanston, IL 60208
Jason Chin
Affiliation:
Dept. of Civil EngineeringNorthwestern University, Evanston, IL 60208
Brian Moran
Affiliation:
Dept. of Civil EngineeringNorthwestern University, Evanston, IL 60208
Leon M. Keer
Affiliation:
Dept. of Civil EngineeringNorthwestern University, Evanston, IL 60208
Morris E. Fine
Affiliation:
Dept. of Materials Science & EngineeringNorthwestern University, Evanston, IL 60208
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Abstract

Eutectic Sn-Ag and Sn-Zn solders are currently being investigated as the basis for replacement of Sn-Pb solders. Some mechanical properties of these solder systems - fatigue, tensile, stress relaxation and creep are presented here along with some damage feature observations for eutectic Sn-Ag solder. Semi-empirical modeling, constitutive modeling and numerical simulation based on damage models have been carried out for lifetime prediction. Preliminary agreement of this numerical simulation with experimental results appears encouraging, but the models need further refinement.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 161
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1. Lau, J.H. and Rice, D.W., Solid State Technology, 28 (10), 91–104 (Oct. 1985).Google Scholar
2. Vaynman, S., Fine, M.E., in Solder Joint Reliability: Theory and Applications, edited by Lau, J.H. (Van Nostrand Reinhold, New York, 1991), p.333.Google Scholar
3. Vaynman, S. and McKeown, S.A., IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16 (3), 317–322 (May 1993).Google Scholar
4. Vaynman, S., in Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95, edited by T.R. Hsu, A. Bar-Cohen, W. Nakayama (ASME, New York, 1995), pp. 663–673.Google Scholar
5. Mavoori, H., Vaynman, S., Chin, J., Moran, B., Keer, L.M., Fine, M.E., in Mechanics and Materials for Electronic Packaging: vol.1- Design & Process Issues in Electronic Packaging, edited by Chen, W.T., Nguyen, L.T., Winterbottom, W.L. (ASME, New York, 1994), pp. 165–179.Google Scholar
6. Lange, W. et al., Phys. Stat. Sol., 1, 50–61 (1961).Google Scholar
7. Lange, W. and Bergner, D., Phys. Stat. Sol., 2, 1410–1414 (1962).Google Scholar
8. Natchtrieb, N.H. and Handler, G.S., J. Chem. Phys., 23, 1569–1570 (1955).Google Scholar
9. Cline, H.E. and Alden, T.H., Trans. AIME, 239, 710–714 (1967).Google Scholar
10. Mavoori, H. and Chin, J., to be presented at the IEEE/CPMT Electronic Components and Technology Conference, Las Vegas, NV, May, 1995.Google Scholar
11. Metals Handbook, 2, 10th ed. (ASM International, Ohio, 1990).Google Scholar
12. Knecht, Sheera and Fox, L.R., IEEE Transactions on Components, Hybrids and Manufacturing Technology, 13 (2), 424–433 (1990).Google Scholar
13. Sherby, O.D. and Burke, P.M., Prog. Mat. Sci., 13, 325–390 (1967).Google Scholar
14. Mei, Z. and Morris, J.W. Jr., Journal of Electronic Materials, 21 (6), 599–607 (1992).Google Scholar
15. Guo, Q., Cutiongco, E.C., Keer, L.M. and Fine, M.E., Journal of Electronic Packaging, 114, 145–151, 1992.Google Scholar
16. Guo, Q., Cutiongco, E. C., Keer, L. M., Fine, M. E., ASME J. of Elec. Pack. 114, 145–151 (1992).Google Scholar
17. Zubelewicz, A. and Keer, L. M., Int. J. Solid and Structure 25, 797–801 (1989).Google Scholar
18. Vaynman, S., Fine, M. E., Jeannotte, D. A., Metall. Trans. 19a, 1051–1059 (1988).Google Scholar
19. Berriche, R., PhD dissertation, Northwestern University, 1989.Google Scholar
20. Zubelewicz, A., Berriche, R., Keer, L. M., Fine, M. E., ASME J. of Elec. Pack. 111, 179–182 (1989).Google Scholar
21. Cutiongco, E. C., Vaynman, S., Fine, M. E., Jeannotte, D. A., ASME J. of Elec. Pack. 112, 110–114 (1990).Google Scholar