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Morphological Effects on the Materials Properties of Polyimides

Published online by Cambridge University Press:  15 February 2011

T. W. Poon ,
J. Leu ,
Y. S. Kang ,
H. C. Liou  and
P. S. Ho
T. W. Poon
Affiliation:
Motorola Inc., Semiconductor Product Sector, K-1, 3501 Ed Bluestein Blvd., Austin, TX 78721
J. Leu
Affiliation:
Center for Materials Sciences and Engineering, University of Texas at Austin, Austin, TX 78712
Y. S. Kang
Affiliation:
Center for Materials Sciences and Engineering, University of Texas at Austin, Austin, TX 78712
H. C. Liou
Affiliation:
Center for Materials Sciences and Engineering, University of Texas at Austin, Austin, TX 78712
P. S. Ho
Affiliation:
Center for Materials Sciences and Engineering, University of Texas at Austin, Austin, TX 78712
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Abstract

We have carried out a comparative study on the thermomechanical properties and interfacial fracture for two polyimides, a rigid-rod like BPDA-PDA and a flexible-chain PMDA-ODA. This study is focused on the correlation between material strength and polymeric chain morphology. A strong correlation was observed, with high chain packing order giving rise to strong material strength. Quantitatively, the mechanical strength of PMDA-ODA thin films along the direction tangential to the film plane is about 1/3 of that of BPDA-PDA, and its thermal expansivity 1.5 to 5 times larger. For fracture, the mechanical strength of the polyimide plays a different role. A softer polyimide such as PMDA-ODA will strengthen the confinement exerted by the metal lines with smaller interfacial strain, thereby decreasing the amount of deformation transmitted through the interface into the metal, and shifting the onset of delamination to a higher strain on the entire structure. However, the same softer polyimide layer also induces a larger amount of plastic deformation, leading to fracture of the film at a smaller strain. For a strong metal/polymer interface, the strength of the interfacial bonds is sufficient to hold the interface intact while the polymer near the interface deforms plastically because it is much softer mechanically than the metal. This continues until the deformation energy accumulated in the polymer is sufficient to delaminate the interface. Under this condition, the locus of failure will be determined by the relative fracture toughness of the polymer compared with the interface, which may very well occur in the polymer very close to the interface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 333
Copyright
Copyright © Materials Research Society 1994

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References

[1] Eastman, D. E., MRS Symposium Proceedings on Advanced Electronic Packaging materials, 167, 3 (1989).Google Scholar
[2] Tummala, R. R. and Rymaszewski, E. J., Microelectronics packaging Handbook (Van Nostrand Reinhold, New York, 1989).Google Scholar
[3] Terasava, M., Minami, S., and Rubin, J., Int. J. Hybrid Microelectron, 6, 607 (1983).Google Scholar
[4] Watari, T. and Murano, H., IEEE Trans. Component Hybrid Maunf Technol. CHMT-8, 462 (1985).Google Scholar
[5] See for example, Lacombe, R. H. in Surface and Colloid Science in Computer Technology, ed. by Mittal, K. L. (Plenum Press, New York, 1987).Google Scholar
[6] Polyimides: Materials, Chemistry and Characterization, edited by Feger, C., Khojastech, M.M. and MeGrath, J. E. (Elsevier, Amsterdam, 1989).Google Scholar
[7] Leu, J., Poon, T.W., Kang, Y.-S., and Ho, P.S., paper presented at Techcon'93, Semiconductor Research Corporation, Atlanta, Georgia (Sept.28–30, 1993)Google Scholar
[8] Poon, T.W., Silverman, B.D., Saraf, R.F., Rossi, A.R., and Ho, P.S., Phys. Rev. B, 46, 11456, (1992).Google Scholar
[9] Poon, T.W., Saraf, R.F., and Silverman, B.D., Macromolecules, 26, 3369 (1993).Google Scholar
[10] Liou, H.C., Leu, J., and Ho, P.S., paper presented at Techcon'93, Semiconductor Research Corporation, Atlanta, Georgia (Sept.28–30, 1993)Google Scholar
[11] Leu, J., Chiu, S.-L., and Ho, P.S., To appear in J. Appl. Phys. 1994.Google Scholar
[12] Poon, T.W., Leu, J., Kasthurirangan, J., and Ho, P.S., To be published.Google Scholar
[13] Haight, R., White, R.C., Silverman, B. D. and Ho, P.S., J. Vac. Sci. Technol. A 6, 2188 (1988)Google Scholar