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Near-Plastic Threshold Indentation and the Residual Stress in Thin Films

Published online by Cambridge University Press:  15 February 2011

J. E. Houston  and
T. A. Michalske
J. E. Houston
Affiliation:
Sandia National Laboratories Albuquerque, NM 87185-1413
T. A. Michalske
Affiliation:
Sandia National Laboratories Albuquerque, NM 87185-1413
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Abstract

In recent studies, we used the Interfacial Force Microscope in a nanoindenter mode to survey the nanomechanical properties of Au films grown on various substrates. Quantitative tabulations of the indentation modulus and the maximum shear stress at the plastic threshold showed consistent values over individual samples but a wide variation from substrate to substrate. These values were compared with film properties such as the surface roughness, average grain size and interfacial adhesion and no correlation was found. However, in a subsequent analysis of the the results, we found consistencies which support the integrity of the data and point to the fact that the results are sensitive to some property of the various film/substrate combinations. In the present paper, we discuss these consistencies and show recent measurements which strongly suggest that the property that is being probed is the residual stress in the films caused by their interaction with the substrate surfaces.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 436: Symposium CC – Thin Films Stresses and Mechanical Properties VI , 1996 , 3
Copyright
Copyright © Materials Research Society 1997

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References

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