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A New Scanning Thermal Microprobe

Published online by Cambridge University Press:  10 February 2011

Yongxia Zhang ,
Yanwei Zhang ,
Juliana Blaser ,
T. S. Sriiram  and
R. B. Marcus
Yongxia Zhang
Affiliation:
Philips Semiconductor, Sunnyvale, CA 94088, yongxia.zhang@sv.sc.philips.com
Yanwei Zhang
Affiliation:
Ball Semiconductor, Inc., 660 N Dorothy Dr. #450, Richardson, TX 75081
Juliana Blaser
Affiliation:
Digital Equipment Corp., 77 Reed Road, HiL02-3iL 12, Hudson, MA 01749–2895
T. S. Sriiram
Affiliation:
Digital Equipment Corp., 77 Reed Road, HiL02-3iL 12, Hudson, MA 01749–2895
R. B. Marcus
Affiliation:
Murray Hill Devices, Inc., 133 Colchester Rd., Murray Hill, NJ 07974, marcus@tesla.njit.edu
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Abstract

A thermal microprobe has been designed and built for high resolution temperature sensing. The thermal sensor is a thin-film thermocouple junction at the tip of an Atomic Force Microprobe (AFM) silicon probe needle. Only wafer-stage processing steps are used for the fabrication. The thermal response over the range 25–s 4.5–rovolts per degree C and is linear.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 503: Symposium JJ – Nondestructive Characterization of Materials in Aging Systems , 1997 , 321
Copyright
Copyright © Materials Research Society 1998

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References

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