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Optical Interconnects and Interfaces for Electronic Subsystems

Published online by Cambridge University Press:  15 February 2011

K. Rajasekharan ,
J.P. Krusius ,
J. Sutherland  and
G. George
K. Rajasekharan
Affiliation:
Cornell University, School of Electrical Engineering, and Alliance for Electronic Packaging, Ithaca, New York 14853
J.P. Krusius
Affiliation:
Cornell University, School of Electrical Engineering, and Alliance for Electronic Packaging, Ithaca, New York 14853
J. Sutherland
Affiliation:
Cornell University, School of Electrical Engineering, and Alliance for Electronic Packaging, Ithaca, New York 14853
G. George
Affiliation:
Cornell University, School of Electrical Engineering, and Alliance for Electronic Packaging, Ithaca, New York 14853
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Abstract

The potential, feasibility, and time scale of optical interconnect and interfaces are examined for electronic computer applications. Link, bus and random interconnect topologies are included. Recent developments in optical source and detector devices, optical waveguides and optical fiber characteristics are reviewed. Then optical coupling, alignment, interfacing and overall compatibility issues are explored. From this understanding the requirements for the packaging of optical interconnect are derived. Finally key research and development needs are defined.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 319
Copyright
Copyright © Materials Research Society 1992

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