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Plasma Polymerization of Low Dielectric Constant Fluoro-Hydrocarbon Film

Published online by Cambridge University Press:  10 February 2011

Wei William Lee
Affiliation:
now with TSMC, (2410) NO. 9, Creation Rd. 1, Science-Based Ind. Park, Hsin-Chu, Taiwan, wwlee@tsmc.com.tw
George Tyndall
Affiliation:
IBM Almaden Research Center, San Jose, CA 95120
Raymond Zehringer
Affiliation:
IBM Almaden Research Center, San Jose, CA 95120
Mark Crowder
Affiliation:
IBM Almaden Research Center, San Jose, CA 95120
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Abstract

Low dielectric constant fluoro-hydrocarbon polymer films were deposited using an electron cyclotron resonance (ECR) plasma source with pentafluorostyrene as a precursor. The pentafluorostyrene is a cyclic liquid monomer with relative high vapor pressure. The chemical structure of the deposited films were characterized by X-ray photoelectron spectroscopy, infrared spectroscopy and Rutherford backscattering spectroscopy. The structure of deposited films studies gave an insight of the fluorohydrocarbon polymer formation regarding to deposition conditions. The dielectric constant of the film was found in the range of 2.2 to 2.4. The influence of deposition conditions on chemical, physical and electrical properties of the resulting films were evaluated.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

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