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Preparation and Characterization of Copper Film on Plastic Substrate by ECR-MOCVD Coupled with a DC Bias

Published online by Cambridge University Press:  17 March 2011

Bup Ju Jeon  and
Joong Kee Lee
Bup Ju Jeon
Affiliation:
Eco-Nano Research Center, Korea Institute of Science and Technology, P.O.Box 131, Cheongyang Seoul 130-650, Korea
Joong Kee Lee
Affiliation:
Eco-Nano Research Center, Korea Institute of Science and Technology, P.O.Box 131, Cheongyang Seoul 130-650, Korea
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Abstract

Copper films were prepared at room temperature under a Cu(hfac)2-Ar-H2 atmosphere in order toobtain metallized plastics by using ECR-MOCVD (Electron Cyclotron Resonance Metal OrganicChemical Vapor Deposition) coupled with a DC bias system. Structural analysis of the films byECR showed that fine copper grains were embedded in an amorphous plastic matrix with goodadherence. Considering the AES result of the film prepared by ECR-CVD, we construe that thecopper film is chemically bonded with a plastic substrate. The delamination force determined bythe nano-scratch tester® showed in the range from 10 to 20mN.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F3.23
Copyright
Copyright © Materials Research Society 2004

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