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Recent Advances in Oxide Glass Fiber Science

Published online by Cambridge University Press:  14 March 2011

Ernest L. Lawton ,
Frederick T. Wallenberger  and
Hong Li
Ernest L. Lawton
Affiliation:
PPG Industries, Fiber Glass Science and Technology ESM Science and Technology Center Lexington, NC 27293-0949, U.S.A.
Frederick T. Wallenberger
Affiliation:
PPG Industries, Fiber Glass Science and Technology Fundamental Science and Technology, Glass Technology Center Pittsburgh, PA 15230-2844, U.S.A.
Hong Li
Affiliation:
PPG Industries, Fiber Glass Science and Technology Fundamental Science and Technology, Glass Technology Center Pittsburgh, PA 15230-2844, U.S.A.
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Abstract

The predominate substrate for multilayer printed wiring boards is laminate constructed from epoxy resin reinforced with fiber glass fabrics. This combination of materials dominates the segment of the electronics market where dimensional stability of the substrate is critical. The rapid development of high speed digital and analog electronic systems has challenged the predominance of fiber glass as the reinforcement of choice. As systems move to the GHz frequency range, there is a need for lower dielectric constant of the substrate to insure integrity and speed of signals. A lower dissipation factor of the substrate is desired for the wireless communication applications of printed wiring boards. A review is presented of materials competing as substrates for the high speed application of the printed wiring board market.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 702: Symposium U – Advanced Fibers, Plastics, Laminates and Composites , 2001 , U5.2.1
Copyright
Copyright © Materials Research Society 2002

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References

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