Hostname: page-component-76fb5796d-2lccl Total loading time: 0 Render date: 2024-04-29T10:31:56.550Z Has data issue: false hasContentIssue false

Role Of Surface Defects In Metal-Ceramic Bonding

Published online by Cambridge University Press:  25 February 2011

S. M. Mukhopadhyay
Affiliation:
Dept. of Metallurgy and Materials Sci., Polytechnic Univ., 333 Jay Street. Brooklyn, NY, 11201.
C. S. Chen
Affiliation:
Dept. of Metallurgy and Materials Sci., Polytechnic Univ., 333 Jay Street. Brooklyn, NY, 11201.
Get access

Abstract

The interfacial chemistry between Ni and Al2O3 has been studied during the initial stages of bonding. We have evaporated thin films of Ni on different alumina substrates (thin oxide film on metallic Al, polished and scratched sapphire crystals, surface with second phase precipitates) and have analyzed how the interface grows, in situ, using X-ray Photoelectron Spectroscopy. It was found that a certain fraction of the first monolayer of Ni which forms on the alumina surface undergoes charge transfer to form NiO. This is due to oxygen-active sites such as unattached oxygen bonds on the surface. A measure of the concentration of such sites can therefore be obtained from the submonolayer fraction of Ni that gets oxidized. It was found that a rough surface offered less oxidation sites for Ni than a smooth one whereas a surface with second phase MgAI2O4 (spinel) precipitates offered more oxidation sites. Also, there is much less oxidation on a thin film of amorphous alumina grown on metallic Al than on a polished bulk sapphire surface. The implications of these studies to further understanding of the metal-ceramic interface have been discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1) Desianinq Interfaces for Technological Applications: Ceramic-Ceramic. Ceramic-Metal Joining. Edited by Peteves, S.D., (Elsevier Publishers 1989).Google Scholar
2) Ohuchi, F.S. and Kohyama, M., J. Am. Ceram. Soc, 74, 6, 1163 (1991)Google Scholar
3) Kingery, W.D. et al. pp 209 in Introduction to Ceramics. 2nd ed., (John Wiley and Sons 1976).Google Scholar
4) Zhong, Q. and Ohuchi, F.S.. J. Vac. Sci. Technol., A, 8. 3, 2107 (1990).Google Scholar
5) Klomp, J.N., Ceramic Bulletin, Vol.59, No.8, 794 (1980).Google Scholar
6) Dufour, L.C. and Perdereau, M., “Metals on Oxides: Formation, Characterization and Properties”, pp 577 in Surface and Near-Surface Chemistry of Oxide Materials, ed. by Nowotny, and Dufour, , (Elsevier Science, 1989).Google Scholar
7)Handbook of X-Ray Photoelectron Spectroscopy”, ed. by Mulinberg, G.E., Perkin-, Elmer, Physical Electronics Div. (1989).Google Scholar
8) Mukhopadhyay, S.M., Jardine, A.P., Baik, S. and BIakely, J.M., J. Am. Cer. Soc, 71, 5, 358 (1988).Google Scholar
9) Jardine, A.P., Mukhopadhyay, S.M. and BIakely, J.M., pp 365 in Beam Solid Interactions and Transient Processes, Mat. Res. Soc. Symp. Proc. (1987).Google Scholar
10) Mukhopadhyay, S.M. and Blakely, J.M., pp 415 in Characterization of the Structure and Chemistry of Defects in Materials. (Mat. Res. Soc. Symp. Proc. 1989).Google Scholar
11) Bianconi, A., Bachrach, R.Z., Hagstorm, S.B.M. and FIodstrom, S.A., Phys Rev. B, !9, 6, 2837 (1979).Google Scholar